SBVS363B December   2020  – November 2025 TPS7B87-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Power-Good (PG)
      2. 6.3.2 Adjustable Power-Good Delay Timer (DELAY)
      3. 6.3.3 Undervoltage Lockout
      4. 6.3.4 Thermal Shutdown
      5. 6.3.5 Current Limit
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input and Output Capacitor Selection
      2. 7.1.2 Dropout Voltage
      3. 7.1.3 Reverse Current
      4. 7.1.4 Power Dissipation (PD)
        1. 7.1.4.1 Thermal Performance Versus Copper Area
        2. 7.1.4.2 Power Dissipation Versus Ambient Temperature
      5. 7.1.5 Estimating Junction Temperature
      6. 7.1.6 Pulling Up the PG Pin to a Different Voltage
      7. 7.1.7 Power-Good
        1. 7.1.7.1 Setting the Adjustable Power-Good Delay
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Capacitor
        2. 7.2.2.2 Output Capacitor
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package Mounting
        2. 7.4.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
  • KVU|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

specified at TJ = –40°C to +150°C, VIN = 13.5 V,  IOUT = 0mA, COUT = 2.2 µF, 1mΩ < COUT ESR < 2Ω,  CIN = 1 µF typical values are at TJ = 25°C
PARAMETER Test Conditions MIN TYP MAX UNIT
VOUT Regulated output VIN = VOUT + 1V to 40V, IOUT = 100 µA to 450mA, TJ = 25ºC(1) –0.85 0.85 %
VIN = VOUT + 1V to 40V, IOUT = 100 µA to 500mA, TJ = 25ºC(1) –0.85 0.85
VIN = VOUT + 1V to 40V, IOUT = 100 µA to 450mA(1) –1.15 1.15
VIN = VOUT + 1V to 40V, IOUT = 100 µA to 500mA(1) –1.15 1.15
ΔVOUT(ΔIOUT) Load regulation (B Version) VIN = VOUT + 1V, IOUT = 100 µA to 450mA , VOUT ≥ 3.3V 0.45 %
VIN = VOUT + 1V, IOUT = 100 µA to 500mA , VOUT ≥ 3.3V 0.475 %
ΔVOUT(ΔIOUT) Load regulation VIN = VOUT + 1V, IOUT = 100 µA to 450mA , VOUT ≥ 3.3V 0.425 %
VIN = VOUT + 1V, IOUT = 100 µA to 500mA , VOUT ≥ 3.3V 0.45
ΔVOUT(ΔVIN) Line regulation VIN = VOUT + 1V to 40V,  IOUT = 100 µA 0.2 %
ΔVOUT Load transient response settling time(2) tR = tF = 1 µs; COUT = 10 µF, VOUT ≥ 3.3V 100 µs
ΔVOUT Load transient response overshoot, undershoot(2) tR = tF = 1 µs; COUT = 10 µF IOUT = 150mA to 350mA –2% %VOUT
IOUT = 350mA to 150mA 10%
IOUT = 0mA to 500mA –10%
IQ Quiescent current VIN = VOUT + 1V to 40V, IOUT = 0mA, TJ = 25ºC(3) 17 21 µA
VIN = VOUT + 1V to 40V, IOUT = 0mA(3) 26
IOUT = 500 µA 35
VDO Dropout voltage fixed output voltages (DDA Package) IOUT ≤ 1mA, VOUT ≥ 3.3V, VIN = VOUT(NOM) x 0.95 43 mV
IOUT = 315mA, VOUT ≥ 3.3V, VIN = VOUT(NOM) 260 360
IOUT = 450mA, VOUT ≥ 3.3V, VIN = VOUT(NOM) 335 475
IOUT = 500mA, VOUT ≥ 3.3V, VIN = VOUT(NOM) 360 535
VDO Dropout voltage fixed output voltages (KVU Package) IOUT ≤ 1mA, VOUT ≥ 3.3V, VIN = VOUT(NOM) x 0.95 46 mV
IOUT = 315mA, VOUT ≥ 3.3V, VIN = VOUT(NOM) 275 400
IOUT = 450mA, VOUT ≥ 3.3V, VIN = VOUT(NOM) 360 525
IOUT = 500mA, VOUT ≥ 3.3V, VIN = VOUT(NOM) 390 575
VUVLO(RISING) Rising input supply UVLO VIN rising 2.6 2.7 2.82 V
VUVLO(FALLING) Falling input supply UVLO VIN falling 2.38 2.5 2.6 V
VUVLO(HYST) V UVLO(IN) hysteresis 230 mV
ICL Output current limit VIN = VOUT + 1V, VOUT short to 90% x VOUT(NOM) 540 780 mA
PSRR Power supply rejection ratio VIN - VOUT = 1V, frequency = 1kHz, IOUT = 450mA 70 dB
RPG Power-good internal pull up resistor 10 30 50 kΩ
VPG(OL) PG pin low level output voltage VOUT ≤ 0.83x VOUT 0.4 V
VPG(TH,RISING) Default power-good threshold VOUT rising 85 95 %VOUT
VPG(TH,FALLING) Default power-good threshold VOUT falling 83 93
VPG(HYST) Power-good hysteresis 2
VDLY(TH) Threshold to release power-good high Voltage at DELAY pin rising 1.17 1.21 1.25 V
IDLY(CHARGE) Delay capacitor charging current Voltage at DELAY pin = 1V 1 1.5 2 µA
TJ Junction temperature –40 150 °C
TSD(SHUTDOWN) Junction shutdown temperature 175 °C
TSD(HYST) Hysteresis of thermal shutdown 20 °C
(1) Power dissipation is limited to 2W for device production testing purposes. The power dissipation can be higher during normal operation. See the thermal dissipation section for more information on how much power the device can dissipate while maintaining a junction temperature below 150℃.
(2) Specified by design.
(3) For the adjustable output this is tested in unity gain and resistor current is not included.