SLLSF73C February   2018  – September 2019 TS3USBCA4

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (3 V ≤ VCC ≤ 3.6 V)
    6. 6.6  Electrical Characteristics (2.4 V ≤ VCC ≤ 5.5 V)
    7. 6.7  Switching Characteristics (2.4 V ≤ VCC ≤ 5.5 V)
    8. 6.8  Timing Requirements (3 V ≤ VCC ≤ 3.6 V)
    9. 6.9  Timing Requirements (2.4 V ≤ VCC ≤ 5.5 V)
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Audio Path
      2. 8.3.2 High-Speed Paths
      3. 8.3.3 3-level Input
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 TS3USBCA4 Registers
        1. 8.6.1.1 Revision_ID Register (Offset = 9h) [reset = 0h]
          1. Table 8. Revision_ID Register Field Descriptions
        2. 8.6.1.2 General_1 Register (Offset = Ah) [reset = 0h]
          1. Table 9. General_1 Register Field Descriptions
        3. 8.6.1.3 General_2 Register (Offset = Bh) [reset = 0h]
          1. Table 10. General_2 Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

  • The VCC pin must have de-coupling capacitors placed as closely to the device as possible. Typically recommended capacitors are a 0.1-µF and a 1-µF capacitor.
  • The total resistance from SBU1 and SBU2 pins of the type-C connector to the MIC_GND1 and MIC_GND2 pins of the audio codec should be kept low to avoid degrading the crosstalk performance.
  • Route the I2C and digital signals away from the audio signals to prevent coupling onto the audio lines.