SLUSAP2J March   2012  – November 2021 UCD3138

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison Table
    1. 6.1 Product Family Comparison
    2. 6.2 Product Selection Matrix
  7. Pin Configuration and Functions
    1. 7.1 UCD3138RGC 64 QFN Pin Attributes
    2. 7.2 UCD3138RHA, UCD3138RMH and UCD3138RJA Pin Attributes
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing and Switching Characteristics
    7. 8.7 Power Supply Sequencing
    8. 8.8 Peripherals
      1. 8.8.1 Digital Power Peripherals (DPPs)
        1. 8.8.1.1 Front End
        2. 8.8.1.2 DPWM Module
        3. 8.8.1.3 DPWM Events
        4. 8.8.1.4 High Resolution DPWM
        5. 8.8.1.5 Oversampling
        6. 8.8.1.6 DPWM Interrupt Generation
        7. 8.8.1.7 DPWM Interrupt Scaling/Range
    9. 8.9 Typical Temperature Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 ARM Processor
    3. 9.3 Memory
      1. 9.3.1 CPU Memory Map and Interrupts
      2. 9.3.2 Boot ROM
      3. 9.3.3 Customer Boot Program
      4. 9.3.4 Flash Management
    4. 9.4 System Module
      1. 9.4.1 Address Decoder (DEC)
      2. 9.4.2 Memory Management Controller (MMC)
      3. 9.4.3 System Management (SYS)
      4. 9.4.4 Central Interrupt Module (CIM)
    5. 9.5 Feature Description
      1. 9.5.1  Sync FET Ramp and IDE Calculation
      2. 9.5.2  Automatic Mode Switching
        1. 9.5.2.1 Phase Shifted Full Bridge Example
        2. 9.5.2.2 LLC Example
        3. 9.5.2.3 Mechanism for Automatic Mode Switching
      3. 9.5.3  DPWMC, Edge Generation, IntraMux
      4. 9.5.4  Filter
        1. 9.5.4.1 Loop Multiplexer
        2. 9.5.4.2 Fault Multiplexer
      5. 9.5.5  Communication Ports
        1. 9.5.5.1 SCI (UART) Serial Communication Interface
        2. 9.5.5.2 PMBUS
        3. 9.5.5.3 General Purpose ADC12
        4. 9.5.5.4 Timers
          1. 9.5.5.4.1 24-bit PWM Timer
          2. 9.5.5.4.2 16-Bit PWM Timers
          3. 9.5.5.4.3 Watchdog Timer
      6. 9.5.6  Miscellaneous Analog
      7. 9.5.7  Package ID Information
      8. 9.5.8  Brownout
      9. 9.5.9  Global I/O
      10. 9.5.10 Temperature Sensor Control
      11. 9.5.11 I/O Mux Control
      12. 9.5.12 Current Sharing Control
      13. 9.5.13 Temperature Reference
    6. 9.6 Device Functional Modes
      1. 9.6.1 Normal Mode
      2. 9.6.2 Phase Shifting
      3. 9.6.3 DPWM Multiple Output Mode
      4. 9.6.4 DPWM Resonant Mode
      5. 9.6.5 Triangular Mode
      6. 9.6.6 Leading Edge Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 PCMC (Peak Current Mode Control) PSFB (Phase Shifted Full Bridge) Hardware Configuration Overview
        2. 10.2.2.2 DPWM Initialization for PSFB
        3. 10.2.2.3 DPWM Synchronization
        4. 10.2.2.4 Fixed Signals to Bridge
        5. 10.2.2.5 Dynamic Signals to Bridge
        6. 10.2.2.6 System Initialization for PCM
          1. 10.2.2.6.1 Use of Front Ends and Filters in PSFB
          2. 10.2.2.6.2 Peak Current Detection
          3. 10.2.2.6.3 Peak Current Mode (PCM)
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Introduction To Power Supply and Layout Recommendations
    2. 11.2 3.3-V Supply Pins
    3. 11.3 Recommendation for V33 Ramp up Slew Rate for UCD3138 and UCD3138064
    4. 11.4 Recommendation for RC Time Constant of RESET Pin for UCD3138 and UCD3138064
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 EMI and EMC Mitigation Guidelines
      2. 12.1.2 BP18 Pin
      3. 12.1.3 Additional Bias Guidelines
      4. 12.1.4 UCD3138 Pin Connection Recommendation
        1. 12.1.4.1 Current Amplifier With EADC Connection
        2. 12.1.4.2 DPWM Synchronization
        3. 12.1.4.3 GPIOS
        4. 12.1.4.4 DPWM PINS
        5. 12.1.4.5 EAP and EAN Pins
        6. 12.1.4.6 ADC Pins
      5. 12.1.5 UART Communication Port
      6. 12.1.6 Special Considerations
    2. 12.2 Layout Example
      1. 12.2.1 UCD3138 and UCD3138064 40 Pin
      2. 12.2.2 UCD3138 and UCD3138064 64 Pin
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Code Composer Studio
      2. 13.1.2 Tools and Documentation
    2. 13.2 Documentation Support
      1. 13.2.1 References
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical Packaging and Orderable Information
    1. 14.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Special Considerations

  • The first thing that must be done in any layout is to set up the basic grounding strategy and the placement of the decoupling capacitors. This needs to be prioritized over anything else, even the routing of sensitive feedback signals.
  • If a gate driver device such as UCC27524 or UCC27511 is on the control card and there is a PGND connection, a net-short resistor or large copper trace must be used to tie the PGND to the Power RTN by multiple vias. Also, the net-short element between Power RTN and PGND must be close to the driver IC.
  • Unused ADC pins must be tied to SGND.
  • Avoid putting V33D and V33A long traces or planes close to radiation components. Place them into an internal layer. It is preferred to have ground shielding.
  • Avoid putting bias supplies or SGND or Power RTN directly to across the switching power train where they can couple switching noise. If the grounds are coupled with noise, the decoupling capacitors may not be effective at filtering the noise out.
  • Local capacitors are preferred to provide a short path for switching current, and be careful to select a quiet RETURN point to connect.
  • In a power module or a tiny PCB design, a single solid plane without the grounding separation is shown in Figure 12-7and has a single point connection with power RTN or SGND near the connector. Ensure there is no current flow from power train into the signal ground plane.
    GUID-4952A92C-51E8-43B6-B07E-0F6BE179AD77-low.png Figure 12-7 Single Ground Plane for a Power Module Design