SWRS152N June   2013  – April 2021 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD


  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Attributes
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  External Digital Slow Clock Requirements
    5. 8.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 8.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 8.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 8.8  WLAN Performance: Currents
    9. 8.9  Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    10. 8.10 Bluetooth Performance: Transmitter, BR
    11. 8.11 Bluetooth Performance: Transmitter, EDR
    12. 8.12 Bluetooth Performance: Modulation, BR
    13. 8.13 Bluetooth Performance: Modulation, EDR
    14. 8.14 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals
    15. 8.15 Bluetooth low energy Performance: Transmitter Characteristics
    16. 8.16 Bluetooth low energy Performance: Modulation Characteristics
    17. 8.17 Bluetooth BR and EDR Dynamic Currents
    18. 8.18 Bluetooth low energy Currents
    19. 8.19 Timing and Switching Characteristics
      1. 8.19.1 Power Management
        1. Block Diagram – Internal DC-DCs
      2. 8.19.2 Power-Up and Shut-Down States
      3. 8.19.3 Chip Top-level Power-Up Sequence
      4. 8.19.4 WLAN Power-Up Sequence
      5. 8.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 8.19.6 WLAN SDIO Transport Layer
        1. SDIO Timing Specifications
        2. SDIO Switching Characteristics – High Rate
      7. 8.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. UART 4-Wire Interface – H4
      8. 8.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  9. Detailed Description
    1. 9.1 WLAN Features
    2. 9.2 Bluetooth Features
    3. 9.3 Bluetooth Low Energy Features
    4. 9.4 Device Certification
      1. 9.4.1 FCC Certification and Statement
      2. 9.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 9.4.3 ETSI/CE
      4. 9.4.4 MIC Certification
    5. 9.5 Module Markings
    6. 9.6 Test Grades
    7. 9.7 End Product Labeling
    8. 9.8 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application – WL1835MODGB Reference Design
      2. 10.1.2 Design Recommendations
      3. 10.1.3 RF Trace and Antenna Layout Recommendations
      4. 10.1.4 Module Layout Recommendations
      5. 10.1.5 Thermal Board Recommendations
      6. 10.1.6 Baking and SMT Recommendations
        1. Baking Recommendations
        2. SMT Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. Tools and Software
      3. 11.1.3 Device Support Nomenclature
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. Reel Box
        2. Shipping Box
    3. 12.3 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Tools and Software

For a complete listing of development-support tools, visit the Texas Instruments WL18xx Wiki. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

Design Kits and Evaluation Modules

    AM335x EVM (TMDXEVM3358)The AM335x EVM enables developers to immediately evaluate the AM335x processor family (AM3351, AM3352, AM3354, AM3356, and AM3358) and begin building applications, such as portable navigation, portable gaming, and home and building automation.
    AM437x Evaluation Module (TMDSEVM437X)The AM437x EVM enables developers to immediately evaluate the AM437x processor family (AM4376, AM4377, AM4378, and AM4379 ) and begin building applications, such as portable navigation, patient monitoring, home and building automation, barcode scanners, and portable data terminals.
    BeagleBone Black Development Board (BEAGLEBK)BeagleBone Black is a low-cost, open source, community-supported development platform for Arm Cortex-A8 processor developers and hobbyists. Boot Linux in under 10 seconds and get started on Sitara™ AM335x Arm Cortex-A8 processor development in less than 5 minutes using just a single USB cable.
    WiLink 8 Module 2.4 GHz Wi-Fi + Bluetooth COM8 EVM (WL1835MODCOM8B)The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add Wi-Fi and Bluetooth technology (WL183x module only) to embedded applications based on TI's Sitara microprocessors. TI’s WiLink 8 Wi-Fi + Bluetooth modules are precertified and offer high throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL183x modules only) in a power-optimized design. Drivers for the Linux and Android high-level operating systems (HLOSs) are available free of charge from TI for the Sitara AM335x microprocessor (Linux and Android version restrictions apply).

    Note: The WL1835MODCOM8 EVM is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5-GHz band and extended temperature range, see the WL1837MODCOM8I EVM.

    WL18XXCOM82SDMMC Adapter BoardThe WiLink SDIO board is an SDMMC adapter board and an easy-to-use connector between the WiLink COM8 EVM (WL1837MODCOM8i and WL1835MODCOM8B) and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO and provides a UART connection for Bluetooth technology over an FPC connector or wire cables. In addition, the adapter is a standalone evaluation platform using TI wireless PC debug tools for any WiLink module or chip solution with a PCB 100-pin edge connector. This board is designed for use with various platforms such as the TI Sitara AM335 and AM437.

TI Reference Designs

Find reference designs leveraging the best in TI technology to solve your system-level challenges.

    TI WiLink 8 Wi-Fi/Bluetooth/Bluetooth Smart Audio Multi-Room Cape Reference Design (TIDC-WL1837MOD-AUDIO-MULTIROOM-CAPE) The TI WiLink 8 WL1837MOD audio cape is wireless a multi-room audio reference design used with BeagleBone Black featuring the TI Sitara (AM335x). The WLAN capability of the WiLink 8 device to capture and register precise arrival time of the connected AP beacon is used to achieve ultra-precise synchronization between multiple connected audio devices. The WiLink 8 module (WL1837MOD) offers integrated Wi-Fi/Bluetooth/Bluetooth Smart solution featuring 2.4-GHz MIMO and antenna diversity on the 5-GHz band. The WiLink 8 module offers a best-in-class audio solution featuring multi-room, Airplay® receiver, full audio stack streaming, support for online music services, and much more. This reference design enables customers to design their own audio boards with Wi-Fi/Bluetooth/Bluetooth Smart connectivity from our WiLink 8 module (WL1837MOD) and evaluate audio multi-room software.
    2.4-GHz Wi-Fi + Bluetooth Certified Antenna Design on WiLink 1835 Module (TIDC-WL1835MODCOM8B)The WiLink 1835 Module Antenna reference design combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way the module is certified. Customers can thus evaluate the performance of the module through embedded applications, such as home automation and the Internet of Things that make use of both Wi-Fi and Bluetooth/Bluetooth low energy functionalities found on the WiLink 1835 module. This antenna design is the same layout used during module certification, allowing customers to avoid repeated certification when creating their specific applications.
    Smart Home and Energy Gateway Reference Design (TIEP-SMART-ENERGY-GATEWAY)The Smart Home and Energy Gateway reference design provides example implementation for measurement, management and communication of energy systems for smart homes and buildings. This example design is a bridge between different communication interfaces, such as Wi-Fi, Ethernet, ZigBee or Bluetooth, that are commonly found in residential and commercial buildings. Because objects in homes and buildings are becoming more and more connected and no single RF standard dominates the market, the gateway design must be flexible to accommodate different RF standards. This example gateway addresses the problem by supporting existing legacy RF standards (Wi-Fi, Bluetooth) and newer RF standards ( ZigBee® and BLE).
    Streaming Audio Reference Design (TIDEP0009)The TIDEP0009 Streaming Audio reference design minimizes design time for customers by offering small form factor hardware and major software components, including streaming protocols and Internet radio services. With this reference design, TI offers a quick and easy transition path to the AM335x and WiLink 8 platform solution. This proven combination solution provides key advantages in this market category that helps bring your products to the next level.


    WiLink 8 Wi-Fi Driver for Linux OS (WILINK8-WIFI-NLCP)The NLCP package contains the install package, pre-compiled object and source of the TI Linux Open-Source Wi-Fi image to easily upgrade the default LINUX EZSDK release with the TI WiLink family NLCP Wi-Fi driver. The software is built with Linaro GCC 4.7 and can be added to Linux Software Development Kits (SDKs) that use similar toolchain on other platforms.
    Android Development Kit for Sitara Microprocessors (ANDROIDSDK-SITARA)Although originally designed for mobile handsets, the Android Operating System offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and production today.
    Linux EZ Software Development Kit (EZSDK) for Sitara Processors (LINUXEZSDK-SITARA)Linux SDKs provide Sitara developers with an easy setup and quick out-of-box experience that is specific to and highlights the features of TI's Arm processors. Launching demos, benchmarks, and applications is a snap with the included graphical user interface. The Sitara Linux SDK also allows developers to quickly start development of their own applications and easily add them to the application launcher, which can be customized by the developer.
    TI Dual-Mode Bluetooth Stack (TIBLUETOOTHSTACK-SDK)TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth low energy and is comprised of single-mode and dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, provides simple command line sample applications to speed development and has MFI capability on request.
    Bluetooth Service Pack for WL18xx (WL18XX-BT-SP)The Bluetooth service pack is composed of the following four files: BTS file (TIInit_11.8.32.bts), ILI file (TIInit_11.8.32.ili), XML (TIInit_11.8.32.xml), Release Notes Document, and License Agreement Note.
    TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone with WL18xx and CC256x (TI-BT-STACK-LINUX-ADDON)The Bluetooth Linux Add-On package contains the install package, pre-compiled object, and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM, or BeagleBone. The software is built with Linaro GCC 4.7 and can be added to Linux SDKs that use a similar toolchain on other platforms. The Bluetooth stack is fully qualified (QDID 69886 and QDID 69887), provides simple command line sample applications to speed development, and has MFI capability on request.
    WiLink Wireless Tools for WL18XX Modules (WILINK-BT_WIFI-WIRELESS_TOOLS)The WiLink Wireless Tools package includes the following applications: WLAN Real-Time Tuning Tool (RTTT), Bluetooth Logger, WLAN gLogger, Link Quality Monitor (LQM), HCITester Tool (BTSout, BTSTransform, and ScriptPad). The applications provide all of the capabilities required to debug and monitor WiLink WLAN/Bluetooth/Bluetooth low energy firmware with a host, perform RF validation tests, run pretest for regulatory certification testing, and debug hardware and software platform integration issues.

Development Tools