JAJSPP1A April   2020  – September 2020 CC2640R2L

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RHB Package
    4. 7.4 Signal Descriptions – RHB Package
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Consumption Summary
    5. 8.5  General Characteristics
    6. 8.6  125-kbps Coded (Bluetooth 5) – RX
    7. 8.7  125-kbps Coded (Bluetooth 5) – TX
    8. 8.8  500-kbps Coded (Bluetooth 5) – RX
    9. 8.9  500-kbps Coded (Bluetooth 5) – TX
    10. 8.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 8.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 8.12 2-Mbps GFSK (Bluetooth 5) – RX
    13. 8.13 2-Mbps GFSK (Bluetooth 5) – TX
    14. 8.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 8.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 8.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 8.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 8.18 ADC Characteristics
    19. 8.19 Temperature Sensor
    20. 8.20 Battery Monitor
    21. 8.21 Synchronous Serial Interface (SSI)
    22. 8.22 DC Characteristics
    23. 8.23 Thermal Resistance Characteristics
    24. 8.24 Timing Requirements
    25. 8.25 Switching Characteristics
    26. 8.26 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagram
    3. 9.3  Main CPU
    4. 9.4  RF Core
    5. 9.5  Memory
    6. 9.6  Debug
    7. 9.7  Power Management
    8. 9.8  Clock Systems
    9. 9.9  General Peripherals and Modules
    10. 9.10 Voltage Supply Domains
    11. 9.11 System Architecture
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 5 × 5 External Differential (5XD) Application Circuit
      1. 10.2.1 Layout
  11. 11Device and Documentation Support
    1. 11.1  Device Nomenclature
    2. 11.2  Tools and Software
    3. 11.3  Documentation Support
    4. 11.4  サポート・リソース
    5. 11.5  Texas Instruments Low-Power RF Website
    6. 11.6  Low-Power RF eNewsletter
    7. 11.7  Trademarks
    8. 11.8  静電気放電に関する注意事項
    9. 11.9  Export Control Notice
    10. 11.10 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Device Comparison

Table 6-1 Device Family Overview
Device PHY Support Flash (KB) RAM (KB) GPIO Package(1)
CC2640R2Lxxx(2) Bluetooth low energy
(Normal, High Speed, Long Range)		 128 20 31, 15 RGZ, RHB
CC2640R2Fxxx(2) Bluetooth low energy
(Normal, High Speed, Long Range)		 128 20 31, 15, 14, 10 RGZ, RHB, YFV, RSM
CC2640F128xxx Bluetooth low energy (Normal) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2650F128xxx Multi-Protocol(3) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2630F128xxx IEEE 802.15.4 (ZigBee/6LoWPAN) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2620F128xxx IEEE 802.15.4 (RF4CE) 128 20 31, 10 RGZ, RSM
(1) The package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm × 7-mm VQFN48, RHB is 5-mm × 5-mm VQFN32, RSM is 4-mm × 4-mm VQFN32, and YFV is 2.7-mm × 2.7-mm DSBGA.
(2) CC2640R2L devices contain Bluetooth Low Energy Host and Controller libraries in ROM, leaving more of the 128KB Flash memory available for the customer application when used with supported BLE-Stack software protocol stack releases. Actual use of ROM and Flash memory by the protocol stack may vary depending on device software configuration. See www.ti.com for more details.
(3) The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.