JAJSHI5G august   2012  – april 2023 DLP7000

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  LVDS Timing Requirements
    8. 7.8  LVDS Waveform Requirements
    9. 7.9  Serial Control Bus Timing Requirements
    10. 7.10 Systems Mounting Interface Loads
    11. 7.11 Micromirror Array Physical Characteristics
    12. 7.12 Micromirror Array Optical Characteristics
    13. 7.13 Window Characteristics
    14. 7.14 Chipset Component Usage Specification
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DLPC410 Chipset DMD Features
        1. 8.3.1.1 DLPC410 - Digital Controller for DLP Discovery 4100 Chipset
        2. 8.3.1.2 DLPA200 - DMD Micromirror Driver
        3. 8.3.1.3 DLPR410 - PROM for DLP Discovery 4100 Chipset
        4. 8.3.1.4 DLP7000 - DLP 0.7 XGA 2xLVDS Type-A DMD
          1. 8.3.1.4.1 DLP7000 XGA Chip Set Interfaces
            1. 8.3.1.4.1.1 DLPC410 Interface Description
              1. 8.3.1.4.1.1.1 DLPC410 IO
              2. 8.3.1.4.1.1.2 Initialization
              3. 8.3.1.4.1.1.3 DMD Device Detection
              4. 8.3.1.4.1.1.4 Power Down
          2. 8.3.1.4.2 DLPC410 to DMD Interface
            1. 8.3.1.4.2.1 DLPC410 to DMD IO Description
            2. 8.3.1.4.2.2 Data Flow
          3. 8.3.1.4.3 DLPC410 to DLPA200 Interface
            1. 8.3.1.4.3.1 DLPA200 Operation
            2. 8.3.1.4.3.2 DLPC410 to DLPA200 IO Description
          4. 8.3.1.4.4 DLPA200 to DLP7000 Interface
            1. 8.3.1.4.4.1 DLPA200 to DLP7000 Interface Overview
        5. 8.3.1.5 Measurement Conditions
    4. 8.4 Device Functional Modes
      1. 8.4.1 DMD Operation
        1. 8.4.1.1 Single Block Mode
        2. 8.4.1.2 Dual Block Mode
        3. 8.4.1.3 Quad Block Mode
        4. 8.4.1.4 Global Mode
    5. 8.5 Optical Interface and System Image Quality Considerations
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Package Thermal Resistance
      2. 8.6.2 Case Temperature
      3. 8.6.3 Micromirror Array Temperature Calculation - Lumens Based (typically used for display applications)
      4. 8.6.4 Micromirror Array Temperature Calculation - Power Density Based
      5. 8.6.5 62
    7. 8.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Device Description
      3. 9.2.3 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 DMD Power-Up and Power-Down Procedures
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 DMD Interface
        1. 11.1.3.1 Trace Length Matching
      4. 11.1.4 DLP7000 Decoupling
        1. 11.1.4.1 Decoupling Capacitors
      5. 11.1.5 VCC and VCC2
      6. 11.1.6 DMD Layout
      7. 11.1.7 DLPA200
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1  Device Support
      1. 12.1.1 Device Marking
    2. 12.2  サード・パーティ製品に関する免責事項
    3. 12.3  Documentation Support
      1. 12.3.1 Related Documents
    4. 12.4  ドキュメントの更新通知を受け取る方法
    5. 12.5  サポート・リソース
    6. 12.6  静電気放電に関する注意事項
    7. 12.7  Export Control Notice
    8. 12.8  用語集
    9. 12.9  Related Links
    10. 12.10 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.2.2 Device Description

The DLP7000 XGA chipset offers developers a convenient way to design a wide variety of industrial, medical, telecom and advanced display applications by delivering maximum flexibility in formatting data, sequencing data, and light patterns.

The DLP7000 XGA chipset includes the following four components: DMD Digital Controller (DLPC410), EEPROM (DLPR410), DMD Micromirror Driver (DLPA200), and a DMD (DLP7000).

DLPC410 Digital Controller for DLP Discovery 4100 chipset

  • Provides high speed LVDS data and control interface to the DLP7000.
  • Drives mirror clocking pulse and timing information to the DLPA200.
  • Supports random row addressing.

DLPR410 PROM for DLP Discovery 4100 chipset

  • Contains startup configuration information for the DLPC410.

DLPA200 DMD Micromirror Driver

  • Generates Micromirror Clocking Pulse control (sometimes referred to as a "Reset") of DMD mirrors.

DLP7000 DLP 0.7 XGA 2xLVDS Type-A DMD

  • Steers light in two digital positions (+12° and -12°) using 1024 x 768 micromirror array of aluminum mirrors.
    Table 9-1 DLPC410 Chipset Configuration for 0.7 XGA Chipset
    QUANTITYTI PARTDESCRIPTION
    1DLP7000DLP 0.7 XGA 2xLVDS Type-A DMD
    1DLPC410Digital Controller for DLP Discovery 4100 chipset
    1DLPR410PROM for DLP Discovery 4100 chipset
    1DLPA200DMD Micromirror Driver

Reliable function and operation of DLP7000 XGA chipsets require the components be used in conjunction with each other. This document describes the proper integration and use of the DLP7000 XGA chipset components.

The DLP7000 XGA chipset can be combined with a user programmable Application FPGA (not included) to create high performance systems.