JAJSHI5G august 2012 – april 2023 DLP7000
PRODUCTION DATA
The DMD is designed to conduct absorbed and dissipated heat to the back of the Type A package where it can be removed by an appropriate heat sink. The heat sink and cooling system must be capable of maintaining the package within the specified operational temperatures, refer to Figure 8-10. The total heat load on the DMD is typically driven by the incident light absorbed by the active area; although other contributions include light energy absorbed by the window aperture and electrical power dissipation of the array.