JAJSFM2E April   2018  – September 2019 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     簡略化されたアプリケーション回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions: Full-Duplex Device
    2.     Pin Functions: Half-Duplex Device
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Power Ratings
    6. 8.6  Insulation Specifications
    7. 8.7  Safety-Related Certifications
    8. 8.8  Safety Limiting Values
    9. 8.9  Electrical Characteristics: Driver
    10. 8.10 Electrical Characteristics: Receiver
    11. 8.11 Supply Current Characteristics: Side 1 (ICC1)
    12. 8.12 Supply Current Characteristics: Side 2 (ICC2)
    13. 8.13 Switching Characteristics: Driver
    14. 8.14 Switching Characteristics: Receiver
    15. 8.15 Insulation Characteristics Curves
    16. 8.16 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 10.3.2 Failsafe Receiver
      3. 10.3.3 Thermal Shutdown
      4. 10.3.4 Glitch-Free Power Up and Power Down
    4. 10.4 Device Functional Modes
      1. 10.4.1 Device I/O Schematics
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Data Rate and Bus Length
        2. 11.2.2.2 Stub Length
        3. 11.2.2.3 Bus Loading
      3. 11.2.3 Application Curves
        1. 11.2.3.1 Insulation Lifetime
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 PCB Material
    2. 13.2 Layout Example
  14. 14デバイスおよびドキュメントのサポート
    1. 14.1 ドキュメントのサポート
      1. 14.1.1 関連資料
    2. 14.2 関連リンク
    3. 14.3 ドキュメントの更新通知を受け取る方法
    4. 14.4 コミュニティ・リソース
    5. 14.5 商標
    6. 14.6 静電気放電に関する注意事項
    7. 14.7 Glossary
  15. 15メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

8.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VCC1 Supply voltage, side 1 -0.5 6 V
VCC2 Supply voltage, side 2 -0.5 6 V
VIO Logic voltage level (D, DE, RE, R) -0.5 VCC1+0.5(3) V
IO Output current on R pin -15 15 mA
VBUS Voltage on bus pins (A, B, Y, Z w.r.t GND2) -18 18 V
TJ Junction temperature -40 150 ℃
TSTG Storage temperature -65 150 ℃
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values.
(3) Maximum voltage must not exceed 6 V