JAJSAR0B March   2007  – October 2017 LM95214

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     リモート1温度エラー、TA＝TD
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Temperature-to-Digital Converter
    6. 7.6 Logic Electrical Characteristics: Digital DC Characteristics
    7. 7.7 Switching Characteristics: SMBus Digital
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Conversion Sequence
      2. 8.3.2 Power-On-Default States
      3. 8.3.3 SMBus Interface
      4. 8.3.4 Temperature Conversion Sequence
        1. 8.3.4.1 Digital Filter
      5. 8.3.5 Fault Queue
      6. 8.3.6 Temperature Data Format
      7. 8.3.7 SMBDAT Open-Drain Output
      8. 8.3.8 TCRIT1, TCRIT2, and TCRIT3 Outputs
      9. 8.3.9 TCRIT Limits and TCRIT Outputs
    4. 8.4 Device Functional Modes
      1. 8.4.1 Diode Fault Detection
      2. 8.4.2 Communicating With the LM95214
      3. 8.4.3 Serial Interface Reset
      4. 8.4.4 One-Shot Conversion
    5. 8.5 Register Maps
      1. 8.5.1 LM95214 Registers
        1. 8.5.1.1 Value Registers
          1. 8.5.1.1.1 Local Value Registers
          2. 8.5.1.1.2 Remote Temperature Value Registers With Signed Format
          3. 8.5.1.1.3 Remote Temperature Value Registers With Unsigned Format
        2. 8.5.1.2 Diode Configuration Register
          1. 8.5.1.2.1 Remote 1-4 Offset
        3. 8.5.1.3 Configuration Registers
          1. 8.5.1.3.1 Main Configuration Register
          2. 8.5.1.3.2 Conversion Rate Register
          3. 8.5.1.3.3 Channel Conversion Enable
          4. 8.5.1.3.4 Filter Setting
          5. 8.5.1.3.5 1-Shot
        4. 8.5.1.4 Status Registers
          1. 8.5.1.4.1 Common Status Register
          2. 8.5.1.4.2 Status 1 Register (Diode Fault)
          3. 8.5.1.4.3 Status 2 (TCRIT1)
          4. 8.5.1.4.4 Status 3 (TCRIT2)
          5. 8.5.1.4.5 Status 4 (TCRIT3)
        5. 8.5.1.5 Mask Registers
          1. 8.5.1.5.1 TCRIT1 Mask Register
          2. 8.5.1.5.2 TCRIT2 Mask Registers
          3. 8.5.1.5.3 TCRIT3 Mask Register
        6. 8.5.1.6 Limit Registers
          1. 8.5.1.6.1 Local Limit Register
          2. 8.5.1.6.2 Remote Limit Registers
          3. 8.5.1.6.3 Common Tcrit Hysteresis Register
        7. 8.5.1.7 Identification Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
    3. 9.3 Diode Non-Ideality
      1. 9.3.1 Diode Non-Ideality Factor Effect on Accuracy
      2. 9.3.2 Calculating Total System Accuracy
      3. 9.3.3 Compensating for Different Non-Ideality
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge(3) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
Machine Model ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) Human-body model, 100-pF discharged through a 1.5-kΩ resistor. Machine model, 200-pF discharged directly into each pin. Charged-device model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged.