JAJSDI7C July   2017  – February 2022 TAS2505-Q1

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  I2S/LJF/RJF Timing in Master Mode
    7. 6.7  I2S/LJF/RJF Timing in Slave Mode
    8. 6.8  DSP Timing in Master Mode
    9. 6.9  DSP Timing in Slave Mode
    10. 6.10 I2C Interface Timing
    11. 6.11 SPI Interface Timing
    12. 6.12 Typical Characteristics
      1. 6.12.1 Class D Speaker Driver Performance
      2. 6.12.2 HP Driver Performance
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Audio Analog I/O
      2. 7.3.2 Audio DAC and Audio Analog Outputs
      3. 7.3.3 DAC
      4. 7.3.4 POR
      5. 7.3.5 CLOCK Generation and PLL
      6. 7.3.6 Speaker Driver
      7. 7.3.7 Automotive Diagnostics
    4. 7.4 Device Functional Modes
      1. 7.4.1 Digital Pins
      2. 7.4.2 Analog Pins
      3. 7.4.3 Multifunction Pins
      4. 7.4.4 Analog Signals
        1. 7.4.4.1 Analog Inputs AINL and AINR
      5. 7.4.5 DAC Processing Blocks — Overview
      6. 7.4.6 Digital Mixing and Routing
      7. 7.4.7 Analog Audio Routing
      8. 7.4.8 Digital Audio and Control Interface
        1. 7.4.8.1 Digital Audio Interface
        2. 7.4.8.2 Control Interface
          1. 7.4.8.2.1 I2C Control Mode
          2. 7.4.8.2.2 SPI Digital Interface
        3. 7.4.8.3 Device Special Functions
    5. 7.5 Register Map
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Pad
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • RGE|24
サーマルパッド・メカニカル・データ
発注情報

Layout