JAJSNQ5 may   2023 TPS92629-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 説明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply (SUPPLY)
        1. 7.3.1.1 Power-On Reset (POR)
        2. 7.3.1.2 Supply Current in Fault Mode
      2. 7.3.2  Enable and Shutdown
      3. 7.3.3  Constant-Current Output and Setting (IN)
      4. 7.3.4  Thermal Sharing Resistor (OUT and RES)
      5. 7.3.5  Brightness Control (EN/PWM and ADIM)
      6. 7.3.6  Diagnostics
        1. 7.3.6.1 LED Short-to-GND Detection
        2. 7.3.6.2 LED Open-Circuit and Short-to-Battery Detection
        3. 7.3.6.3 LED Open-Circuit and Short-to-Battery Detection Enable (DIAGEN)
        4. 7.3.6.4 Overtemperature Protection
        5. 7.3.6.5 Low Dropout Operation
      7. 7.3.7  Multi Fault Report
      8. 7.3.8  FAULT Table
      9. 7.3.9  LED Fault Summary
      10. 7.3.10 IO Pins Inner Connection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Undervoltage Lockout, V(SUPPLY) < V(POR_rising)
      2. 7.4.2 Normal Operation V(SUPPLY) ≥ 4.5 V
      3. 7.4.3 Low-Voltage Dropout Operation
      4. 7.4.4 Fault Mode
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Using Analog Dimming Controlled By MCU for Blind Spot Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Multi Fault Report

The multiple fault could be reported out by the different voltage level through fault pins. The fault pin will be pulled down firstly for t(discharge) time in order to generate a falling edge trigger signal for the ADC of MCU. The t(discharge) time is also used as discharge process for LED open-circuit detection and output short-to-battery detection. After the discharge process, the fault pin will be pulled up to a specific voltage level according to the detected fault to achieve multiple fault report for safety critical system, as shown in Figure 7-5

GUID-20220309-SS0I-CF8Q-NNSZ-CQQ8MT8NSXWS-low.svg Figure 7-5 Multiple fault report timing sequence