SLUU224A May   2005  – March 2022 TPS40100

 

  1.   Trademarks
  2. 1Introduction
  3. 2Description
    1. 2.1 Applications
    2. 2.2 Features
      1. 2.2.1 Using Remote Sense (J3)
      2. 2.2.2 Simultaneous Tracking (J3)
      3. 2.2.3 Enable (SW2)
      4. 2.2.4 Margin Up/Down (J4)
      5. 2.2.5 Power Good (J1)
      6. 2.2.6 Synchronization (J1)
  4. 3Electrical Performance Specifications
  5. 4Schematic
  6. 5Test Setup
    1. 5.1 Equipment
      1. 5.1.1 Voltage Source (VIN)
      2. 5.1.2 Meters
      3. 5.1.3 Loads (LOAD1)
      4. 5.1.4 Recommended Wire Gauge
      5. 5.1.5 Other
    2. 5.2 Equipment Setup
      1. 5.2.1 Initial EVM Jumper and Switch Settings
      2. 5.2.2 Procedure
      3. 5.2.3 Start-Up and Shutdown Procedure
      4. 5.2.4 Equipment Shutdown
    3. 5.3 Other Tests
      1. 5.3.1 Adjusting Output Voltage (R1 and R3)
      2. 5.3.2 Remote Sense Test Setup
      3. 5.3.3 Voltage Tracking Test Setup
        1. 5.3.3.1 Single Unit Tracking (Charge)
        2. 5.3.3.2 Single Unit Tracking (Discharge)
      4. 5.3.4 Enable and Disable Test Setup
        1. 5.3.4.1 Power-On Enable
      5. 5.3.5 Margin Test Setup
        1. 5.3.5.1 Margin Up 5%
      6. 5.3.6 Power Good and Synchronization Test Setup
        1. 5.3.6.1 Synchronization
  7. 6TPS40100EVM Typical Performance Data and Characteristics Curves
    1. 6.1 Efficiency
    2. 6.2 Line and Load Regulation
    3. 6.3 Loop Stability
  8. 7EVM Assembly Drawings and Layout
  9. 8List of Materials
  10. 9Revision History

2.2.5 Power Good (J1)

The EVM contains a power-good pin to provide the user with a “power ok” signal. This pin is pulled up through a resistor to the 5VBP pin of the TPS40100. If any of the following conditions occur, the power-good pin will pull low.

  • Soft start is active (VSS < 3.5 V).
  • Tracking is active (Vtrackout > .7 V).
  • VFB < 0.61 V
  • VFB > 0.77 V
  • VUVLO < 1.33 V
  • Overcurrent condition exists
  • Die temperature is greater than 165°C.

This pin can be monitored with an oscilloscope to observe its behavior. Please see Section 5.3.6.