SLVUDI2 September   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Board Overview
    2. 2.2 Key Features
      1. 2.2.1 Processor
      2. 2.2.2 Memory and Storage
      3. 2.2.3 Interface and Peripherals
      4. 2.2.4 Expansion Connectors and Expansion Headers to Support Application-Specific Capes
    3. 2.3 Power Requirements
      1. 2.3.1 Integrated Power Architecture
      2. 2.3.2 Advanced Power Management Features
    4. 2.4 Header Information
      1. 2.4.1 Cape Expansion Headers
      2. 2.4.2 65 Possible Digital I/Os
      3. 2.4.3 PWMs and Timers
      4. 2.4.4 Analog Inputs
      5. 2.4.5 UART
      6. 2.4.6 I2C
      7. 2.4.7 SPI
    5. 2.5 Detailed Hardware Design
      1. 2.5.1 USB Interface
        1. 2.5.1.1 USB 2.0 Type-A Interface
        2. 2.5.1.2 USB 2.0 Type-C® Interface
      2. 2.5.2 Ethernet Interface
      3. 2.5.3 Power Supply Interface
      4. 2.5.4 DDR3L SDRAM Interface
      5. 2.5.5 eMMC Flash Interface
      6. 2.5.6 Micro SD Card Slot Interface
      7. 2.5.7 Grove Connector Interfaces
        1. 2.5.7.1 Grove I2C Interface (J4)
        2. 2.5.7.2 Grove UART Interface (J5)
  8. 3Hardware Design Files
    1. 3.1 Schematics, PCB Layout and BOM
  9. 4Compliance Information
    1. 4.1 Compliance – FCC Requirement
  10. 5Additional Information
    1. 5.1 Known Hardware or Software Issues
    2. 5.2 Trademarks
    3. 5.3 Brand Uses Approval
  11. 6Related Documentation

2 Hardware

BeagleBone Green Eco incorporates a high-performance, low-power system architecture based on the AM335x system-on-chip (SoC). This section presents detailed specifications of all hardware subsystems, including processor specifications, memory configuration, power management circuitry, and interface peripherals. The technical parameters documented herein establish operating conditions, electrical characteristics, and functional capabilities of the device.