SNAU265C june   2021  – july 2023 HDC3020 , HDC3020-Q1 , HDC3021 , HDC3021-Q1 , HDC3022 , HDC3022-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1HDC302x Devices
    1. 1.1 HDC3020 in WSON
    2. 1.2 HDC3021 in WSON
    3. 1.3 HDC3022 in WSON
  5. 2Storage and Handling Guidelines
    1. 2.1 Exposure to Contaminants
    2. 2.2 Chemical Analysis
      1. 2.2.1 Saturation and Recovery Tests
      2. 2.2.2 Long-Term Exposure
    3. 2.3 Packaging and Storing
      1. 2.3.1 Assembly
      2. 2.3.2 Application in Extreme Environment
  6. 3Programming the HDC3020
    1. 3.1 Trigger-On Demand
    2. 3.2 Auto Measurement
    3. 3.3 Programming the CRC
      1. 3.3.1 CRC C Code
    4. 3.4 Condensation Removal
    5. 3.5 Offset Error Correction
      1. 3.5.1 Offset Error Correction Example With a Fingerboard
  7. 4References
  8. 5Revision History

2.3.1 Assembly

The HDC must be added in the last assembly step. In case the PCB passes through multiple solder cycles (as is the case for PCBs that have components on the top and bottom side), adding the HDC last reduces the risk of damage to the sensing polymer from contaminants or excessive heat. Contaminants such as those listed in Exposure to Contaminants must be avoided or minimized. Maximum assembly temperatures and exposure times must not be exceeded.

Note:

It is important that no-clean solder paste is used and no board wash is applied once the sensor is assembled onto the PCB. To ensure proper device performance, these instructions should be communicated to board manufacturers before assembly.