SPRAD05B May 2023 – December 2023 AM620-Q1 , AM623 , AM625 , AM625-Q1 , AM625SIP
The Thermal Design Guide for DSP and Arm Application Processors application report provides guidance for successful implementation of a thermal solution for board designs using Sitara family of processors. This application report provides background information on common terms and methods. Any follow-up design support that may be required will be provided only for board designs that follow thermal design guidelines contained in the application report.
The Thermal Model can be downloaded from the below sections.