SPRUJ91A april   2023  – may 2023 AM68 , AM68 , AM68A , AM68A , TDA4AL-Q1 , TDA4AL-Q1 , TDA4VE-Q1 , TDA4VE-Q1 , TDA4VL-Q1 , TDA4VL-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Contributions to Power
  5. 2How to Use the Tool
  6. 3Use Case
    1. 3.1 Core Processor Utilization
    2. 3.2 Key IP Frequency Selection
    3. 3.3 Memory Interfaces
    4. 3.4 PHYs
    5. 3.5 High Speed Serial Interface
    6. 3.6 Environmental
    7. 3.7 LVCMOS IOs
    8. 3.8 Buttons
    9. 3.9 Starting Use Case
  7. 4Results Sheet
    1. 4.1 Thermal Power Estimate
    2. 4.2 Peak / PDN Power Estimate
  8. 5Three Specific Pre-Loaded Use Case Results
    1. 5.1 ARM Only
    2. 5.2 Superset
    3. 5.3 Valet Park
  9. 6Summary of Power for Pre-Populated Use Cases
  10. 7Revision History

Three Specific Pre-Loaded Use Case Results

The following three use cases are intended to span the expected range of thermal power for this device. A use case can fall outside of this range (Peak / PDN power falls outside of this range.)

Table 5-1 125°C Thermal Power
Use Case Leakage [mW] Dynamic [mW] Total [mW]
ARM only 4720 3950 8670
Superset 6340 10910 17250
Valet Park 6340 9270 15610
Table 5-2 105°C Thermal Power
Use Case Leakage [mW] Dynamic [mW] Total [mW]
ARM only 2570 3950 6520
Superset 3450 10910 14360
Valet Park 3450 9270 12720
Note: Leakage Power – Because all of the power domains are enabled in both Superset and Valet Park use cases, the leakage is the same in both these cases.

As noted, the exponential behavior of the leakage with junction temperature causes a significant decrease in leakage between 125°C and 105°C.