SBOS584F November   2011  – September 2026 OPA180 , OPA2180 , OPA4180

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA180
    5. 6.5 Thermal Information: OPA2180
    6. 6.6 Thermal Information: OPA4180
    7. 6.7 Electrical Characteristics: VS = ±2V to ±18V (VS = 4V to 36V)
    8. 6.8 Typical Characteristics: Table of Graphs
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 EMI Rejection
      3. 7.3.3 Phase-Reversal Protection
      4. 7.3.4 Capacitive Load and Stability
      5. 7.3.5 Electrical Overstress
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Bipolar ±10V Analog Output from a Unipolar Voltage Output DAC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Component Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Discrete INA + Attenuation
      3. 8.2.3 RTD Amplifier
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
Component Selection

DAC: For convenience, devices with an external reference option or devices with accessible internal references are desirable in this application because the reference creates an offset. The DAC selection in this design must primarily be based on DC error contributions typically described by offset error, gain error, and integral nonlinearity error. Occasionally, additional specifications are provided that summarize end-point errors of the DAC typically called zero-code and full-scale errors. For AC applications, slew rate and settling time can require additional consideration.

Amplifier: Amplifier input offset voltage (VIO) is a key consideration for this design. VIO of an operational amplifier is a typical datasheet specification, but in-circuit performance is also affected by drift over temperature, the common-mode rejection ratio (CMRR), and power-supply rejection ratio (PSRR); thus consideration must be given to these parameters as well. For ac operation, additional considerations must be made concerning slew rate and settling time. Input bias current (IIB) can also be a factor, but typically the resistor network is implemented with sufficiently small resistor values that the effects of input bias current are negligible.

Passive: Resistor matching for the op-amp resistor network is critical for the success of this design; components with tight tolerances must be selected. For this design, 0.1% resistor values are implemented, but this constraint can be adjusted based on application-specific design goals. Resistor matching contributes to offset error and gain error in this design; see Bipolar ±10V Analog Output from a Unipolar Voltage Output DAC for further details. The tolerance of the RISOand CCOMP stability components is not critical, and 1% components are acceptable.