SBOS729B October   2015  – October 2025 DRV425

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Fluxgate Sensor Front-End
        1. 6.3.1.1 Fluxgate Sensor
        2. 6.3.1.2 Bandwidth
        3. 6.3.1.3 Differential Driver for the Internal Compensation Coil
        4. 6.3.1.4 Magnetic Field Range, Overrange Indicator, and Error Flag
      2. 6.3.2 Shunt-Sense Amplifier
      3. 6.3.3 Voltage Reference
      4. 6.3.4 Low-Power Operation
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Linear Position Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Current Sensing in Busbars
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Decoupling
      2. 7.3.2 Power-On Start-Up and Brownout
      3. 7.3.3 Power Dissipation
        1. 7.3.3.1 Thermal Pad
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Receiving Notification of Documentation Updates
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision A (March 2016) to Revision B (October 2025)

  • Changed instances of PowerPAD to thermal padGo
  • Changed PSSRAMP parameter min and max values from –50µV/V and 50µV/V to –86µV/V and 86µV/V, respectivelyGo
  • Changed location of sensor details for clarityGo
  • Deleted "Permanently" from 2nd paragraph to clarify that the fluxgate is not permanently saturatedGo
  • Changed Figure 6-5 to show the corrected pin namesGo

Changes from Revision * (October 2015) to Revision A (March 2016)

  • Changed broken links to working linksGo
  • Added last four Applications bullets Go
  • Changed device name in Figure 6-3 Go