SBOSAI8A March   2025  – July 2025 INA630

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Setting the Gain
        1. 7.3.1.1 Gain Error and Drift
      2. 7.3.2 Linear Input Voltage Range
      3. 7.3.3 Input Protection
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reference Pin
      2. 8.1.2 Input Bias Current Return Path
    2. 8.2 Typical Applications
      1. 8.2.1 Current Shunt Monitoring in Battery Testing Systems
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VS Supply voltage Dual supply (–VS), (+VS) –20 20 V
Single supply VS 40
INN, INP, REF, FB Signal input pins Voltage (–VS) – 0.5 (+VS) + 0.5 V
Current –10 10 mA
Differential voltage between INN and INP or REF and FB (–VS) – 0.5 (+VS) + 0.5 V
OUT Signal output pins (–VS) – 0.5 (+VS) + 0.5 V
Output short-circuit(2) Continuous
TA Operating Temperature –50 150 °C
TJ Junction Temperature 175 °C
Tstg Storage Temperature –65 150 °C
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
Short-circuit to VS / 2.