SBOSAL6A June   2025  – September 2025 XTR200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Using an External Transistor
      3. 6.3.3 Error Flag
    4. 6.4 Device Functional Modes
      1. 6.4.1 Current-Output Mode
      2. 6.4.2 Voltage-Output Mode
      3. 6.4.3 Output Disabled
      4. 6.4.4 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Miswiring Protection
      3. 7.1.3 Power Dissipation in Current Output Mode
      4. 7.1.4 Estimating Junction Temperature
    2. 7.2 Typical Applications
      1. 7.2.1 Analog Output Circuit for Field Transmitters
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1.     53
    2. 10.1 Tape and Reel Information

7.4.1 Layout Guidelines

Figure 7-17 shows an example layout for the XTR200. For particular requirements of an application or PCB assembly process, refine the layout. To maximize the performance of the device:

  • Place the RSET resistor as close as possible to the SET and GND pins to minimize trace resistance in series with the RSET resistor.
  • When using the integrated output transistor, short the IS and VG pins together as close as possible to the device. This reduces trace resistance to maximize output headroom and prevent noise coupling into the output signal.
  • Place power supply bypass capacitors near the power supply pin, between the device and any vias used for the supply connection. Provide a low impedance connection to ground for bypass capacitors.
  • Connect the thermal pad to a ground plane or pour and, if possible, extend the ground pour beyond the device to maximize power dissipation.

Soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push, package shear, and similar board-level tests. Even with applications that have low power dissipation, solder the exposed pad to the PCB to provide structural integrity and long-term reliability. Physical dimensions for the package and pad are shown in Mechanical, Packaging, and Orderable Information.