SCAS414AE November   1992  – August 2025 SN74LVC244A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Standard CMOS Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74LVC244A UNIT
DB(2)
(SSOP)		 DGV(2)
(TVSOP)		 DW (2)
(SOIC)		 ZQN(2)
(BGA)		 N(2)
(PDIP)		 NS(2)
(SO)		 PW(2)
(TSSOP)		 RGY(3)
(VQFN)		 RWP(3)
(X1QFN)		 RKS(3)(VQFN)
20 PINS
RθJA Junction-to-ambient
thermal resistance		 108.1 128.7 90.9 198.7 61.6 90.1 114.7 50.3 79.9 87.2 °C/W
RθJC(top) Junction-to-case (top)
thermal resistance		 70.2 43.7 55.3 106.8 46.5 56.4 48.4 58.4 63.2 93.4 °C/W
RθJB Junction-to-board
thermal resistance		 63.3 70.2 58.8 143.1 42.5 57.7 65.6 28.3 46.4 59.8 °C/W
ψJT Junction-to-top
characterization parameter		 30.6 3.1 29.1 24.1 34.6 28.4 6.8 4.9 2.6 24.9 °C/W
ψJB Junction-to-board characterization parameter 62.9 69.5 58.3 119.6 42.4 57.2 65.1 28.4 46.3 59.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — — n/a — — — 22.7 27.3 44.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
(3) The package thermal impedance is calculated in accordance with JESD 51-5.