SCDS473 July   2025 TMUX9612

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings: TMUX961x Devices
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions: TMUX961x Devices
    4. 6.4  Source and Drain Continuous Current
    5. 6.5  Source and Drain Pulse Current
    6. 6.6  Electrical Characteristics (Global): TMUX961x Devices
    7. 6.7  Electrical Characteristics (±110V Dual Supply)
    8. 6.8  Electrical Characteristics (±50V Dual Supply)
    9. 6.9  Electrical Characteristics (100V Single Supply)
    10. 6.10 Switching Characteristics: TMUX961x Devices
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 On-Resistance
    2. 7.2 Off-Leakage Current
    3. 7.3 On-Leakage Current
    4. 7.4 Device Turn-On and Turn-Off Time
    5. 7.5 Charge Injection
    6. 7.6 Off Isolation
    7. 7.7 Crosstalk
    8. 7.8 Bandwidth
    9. 7.9 THD + Noise
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Flat On-Resistance
      3. 8.3.3 Protection Features
        1. 8.3.3.1 Fail-Safe Logic
        2. 8.3.3.2 ESD Protection
        3. 8.3.3.3 Latch-Up Immunity
      4. 8.3.4 1.8V Logic Compatible Inputs
      5. 8.3.5 Integrated Pull-Down Resistor on Logic Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.10 Switching Characteristics: TMUX961x Devices

over operating free-air temperature range (unless otherwise noted) 
typical at VDD = +110V, VSS = –110V, GND = 0V and TA = 25℃  (unless otherwise noted)
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
tON (EN) Turn-on time from enable VS = 10V
RL = 300Ω, CL = 35pF		 25°C 40 µs
–40°C to +85°C 75
–40°C to +125°C 75
tOFF (EN) Turn-off time from enable VS = 10V
RL = 300Ω, CL = 35pF		 25°C 18 µs
–40°C to +85°C 35
–40°C to +125°C 35
tON (VDD) Device turn on time
(VDD to output)		 VDD ramp rate = 20V/µs,
VS = 10V
RL = 300Ω, CL = 35pF		 25°C 45 µs
tPD Propagation delay RL = 50Ω , CL = 5pF 25°C 410 ps
QINJ Charge injection VS = (VDD + VSS) / 2, CL = 1nF 25°C -20 pC
OISO Off isolation RL = 50Ω , CL = 5pF
VS = (VDD + VSS) / 2, f = 100kHz		 25°C –104 dB
XTALK Inter-channel crosstalk RL = 50Ω , CL = 5pF
VS = (VDD + VSS) / 2, f = 100kHz		 25°C –110 dB
BW –3dB bandwidth RL = 50Ω , CL = 5pF
VS = (VDD + VSS) / 2		 25°C 530 MHz
IL Insertion loss RL = 50Ω , CL = 5pF
VS = (VDD + VSS) / 2, f = 1MHz		 25°C -1.13 dB
ACPSRR AC power supply rejection ratio VPP = 0.62V on VDD and VSS
RS = 5Ω, 0.01µF decoupling cap on VOUT
CL = 50pF
f = 1MHz		 25°C –70 dB
THD+N Total harmonic distortion + Noise VPP = (VDD - VSS)/2V (20V cap), VS = (VDD + VSS) / 2
RL  =  1kΩ , CL = 5pF,
f = 20Hz to 20kHz		 25°C 0.0015 %
CS(OFF) Source off capacitance VS = (VDD + VSS) / 2V, f = 1MHz 25°C 5 pF
CD(OFF) Drain off capacitance VS = (VDD + VSS) / 2V, f = 1MHz 25°C 5 pF
CS(ON), CD(ON) On capacitance VS = (VDD + VSS) / 2V, f = 1MHz 25°C 15 pF