SCDS473 July   2025 TMUX9612

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings: TMUX961x Devices
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions: TMUX961x Devices
    4. 6.4  Source and Drain Continuous Current
    5. 6.5  Source and Drain Pulse Current
    6. 6.6  Electrical Characteristics (Global): TMUX961x Devices
    7. 6.7  Electrical Characteristics (±110V Dual Supply)
    8. 6.8  Electrical Characteristics (±50V Dual Supply)
    9. 6.9  Electrical Characteristics (100V Single Supply)
    10. 6.10 Switching Characteristics: TMUX961x Devices
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 On-Resistance
    2. 7.2 Off-Leakage Current
    3. 7.3 On-Leakage Current
    4. 7.4 Device Turn-On and Turn-Off Time
    5. 7.5 Charge Injection
    6. 7.6 Off Isolation
    7. 7.7 Crosstalk
    8. 7.8 Bandwidth
    9. 7.9 THD + Noise
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Flat On-Resistance
      3. 8.3.3 Protection Features
        1. 8.3.3.1 Fail-Safe Logic
        2. 8.3.3.2 ESD Protection
        3. 8.3.3.3 Latch-Up Immunity
      4. 8.3.4 1.8V Logic Compatible Inputs
      5. 8.3.5 Integrated Pull-Down Resistor on Logic Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.1 Absolute Maximum Ratings: TMUX961x Devices

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD–VSS Supply voltage 240 V
VDD –0.5 240 V
VSS –135 0.5 V
VSELx Logic control input pin voltage (SELx) –0.5 50 V
ISELx Logic control input pin current (SELx) –30 30 mA
VS or VD Source or drain voltage (Sx, Dx) VSS–2 VDD+2 V
IDC Source or drain continuous current (Sx, Dx) –200 200 mA
IIK(2) Diode clamp current at 85°C –100 100 mA
Diode clamp current at 125°C –15 15 mA
Tstg Storage temperature –65 150 °C
TA Ambient temperature –55 150 °C
TJ Junction temperature 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Signal path pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings.