SDAA018 December 2025 MSPM0H3216
Table 1-1 describes the main contents that needs to be checked during the MSPM0H hardware design process. The following sections provide more details.
| Pin | Description | Requirements |
|---|---|---|
| VDD | Power supply positive pin | Place 10µF and 100nF capacitors between VDD and VSS and keep those part close to VDD and VSS pins. |
| VSS | Power supply negative pin | |
| NRST | Reset pin | Connect an external 47kΩ pullup resistor with a 10nF to 100nF pulldown capacitor. Adding a capacitor of appropriate capacitance to the reset pin can suppress transient interference caused by ESD, thereby reducing the risk of accidental reset. |
| VREF+ | Voltage reference power supply - external reference input |
|
| VREF- | Voltage reference ground supply - external reference input | |
| SWCLK | Serial wire clock from debug probe | Internal pulldown to VSS, does not need any external part. |
| SWDIO | Bidirectional (shared) serial wire data | Internal pullup to VDD, does not need any external part. |
| PA11 | Default BSL invoke Pin | Keep pulled down to avoid entering BSL mode after reset. (BSL invoke pin can be remapped.) |
| PAx | General-purpose I/O | Set corresponding pin functions to GPIO. (PINCMx.PF = 0x1) |
| Unused PAx | General-purpose I/O | Configure unused pins to output low or input with internal pullup or pulldown resistor. |
| Thermal Pad | Thermal pad on QFN package | The heat of the pad is transferred to the continuous copper plane (such as the GND Plane) of the PCB through the via. The larger the copper area, the better the heat dissipation effect. |
TI recommends connecting a combination of a 10μF and a 0.1nF low-ESR ceramic decoupling capacitor to the VDD and VSS pins Higher-value capacitors can be used but can impact supply rail ramp-up time. Decoupling capacitors must be placed as close as possible to the pins that for decouple (within a few millimeters).
The NRST reset pin is required to connect an external 47kΩ pullup resistor with a 10nF pulldown capacitor.
For devices support external crystals, external bypass capacitors for the crystal oscillator pins are required when using external crystals.