SLASFD0A December   2024  – June 2025 MSPM0L1116-Q1 , MSPM0L1117-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 Low Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 I2C
      1. 7.15.1 I2C Characteristics
      2. 7.15.2 I2C Filter
      3. 7.15.3 I2C Timing Diagram
    16. 7.16 SPI
      1. 7.16.1 SPI
      2. 7.16.2 SPI Timing Diagram
    17. 7.17 UART
    18. 7.18 TIMx
    19. 7.19 TRNG Electrical Characteristics
    20. 7.20 TRNG Switching Characteristics
    21. 7.21 Emulation and Debug
      1. 7.21.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 VREF
    16. 8.16 Security
    17. 8.17 TRNG
    18. 8.18 AESADV
    19. 8.19 Keystore
    20. 8.20 CRC-P
    21. 8.21 UART
    22. 8.22 I2C
    23. 8.23 SPI
    24. 8.24 Low-Frequency Sub System (LFSS)
    25. 8.25 RTC_B
    26. 8.26 IWDT_B
    27. 8.27 WWDT
    28. 8.28 Timers (TIMx)
    29. 8.29 Device Analog Connections
    30. 8.30 Input/Output Diagrams
    31. 8.31 Serial Wire Debug Interface
    32. 8.32 Bootstrap Loader (BSL)
    33. 8.33 Device Factory Constants
    34. 8.34 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

8.25 RTC_B

The RTC_B instance of the real-time clock operates off of a 32kHz input clock source (typically a low frequency crystal) and provides a time base to the application with multiple options for interrupts to the CPU. The RTC_B provides common key features in relation to the Low-Frequency Sub System (LFSS).

Common key features of the RTC_B include:

  • Counters for seconds, minutes, hours, day of the week, day of the month, month, and year
  • Binary or BCD format
  • Leap-year handling
  • One customizable alarm interrupt based on minute, hour, day of the week, and day of the month
  • Interval alarm interrupt to wake every minute, every hour, at midnight, or at noon
  • Interval alarm interrupt providing periodic wake-up at 4096, 2048, 1024, 512, 256, or 128 Hz
  • Interval alarm interrupt providing periodic wake-up at 64, 32, 16, 8, 4, 2, 1, and 0.5 Hz
  • Calibration for crystal offset error (up to +/- 240ppm)
  • Compensation for temperature drift (up to +/- 240ppm)
  • RTC clock output to pin for calibration

Table 8-10 shows the RTC features supported in this device.

Table 8-10 RTC_B Key Features

RTC Features

RTC_B

Power enable register

-

Real-time clock and calendar mode providing seconds, minutes, hours, day of week, day of month, and year

Yes

Selectable binary or binary-coded decimal (BCD) format

Yes

Leap-year correction (valid for year 1901 through 2099)

Yes

Two customizable calendar alarm interrupts based on minute, hour, day of the week, and day of the month

Yes

Interval alarm interrupt to wake every minute, every hour, at midnight, or at noon

Yes

Periodic interrupt to wake at 4096, 2048, 1024, 512, 256, or 128Hz

Yes

Periodic interrupt to wake at 64, 32, 16, 8, 4, 2, 1, and 0.5Hz

Yes

Interrupt capability down to STANDBY mode with STOPCLKSTBY

Yes

Calibration for crystal offset error and crystal temperature drift (up to ±240 ppm total)

Yes

RTC clock output to pin for calibration (GPIO)

Yes

RTC clock output to pin for calibration (TIO)

-

Three -bit prescaler for heartbeat function with interrupt generation

-

RTC external clock selection of untrimmed 32kHz, trimmed 512Hz, 256Hz or 1Hz

-

RTC time stamp capture upon detection of a timer stamp event, including:

  • TIO event

  • VDD fail event

-

RTC counter lock function

-

For more details, see the RTC chapter of the MSPM0 L-Series 32MHz Microcontrollers Technical Reference Manual.