SLASFN5 December   2025 MSPM0L2116 , MSPM0L2117

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 Low Frequency Crystal/Clock
      4. 7.9.4 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Linearity Parameters
      3. 7.12.3 Switching Characteristics
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Electrical Characteristics
      2. 7.14.2 Voltage Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 LCD
    17. 7.17 I2C
      1. 7.17.1 I2C Characteristics
      2. 7.17.2 I2C Filter
      3. 7.17.3 I2C Timing Diagram
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 Emulation and Debug
      1. 7.21.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA Trigger Mapping
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripherals Summary
      3. 8.7.3 Interrupt Vector Number
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 LFSS
    15. 8.15 IWDT
    16. 8.16 RTC_B
    17. 8.17 VREF
    18. 8.18 COMP
    19. 8.19 Security
    20. 8.20 AESADV
    21. 8.21 CRC
    22. 8.22 Keystore
    23. 8.23 UNICOMM (UART/I2C/SPI)
      1. 8.23.1 UART (UNICOMM)
      2. 8.23.2 I2C (UNICOMM)
      3. 8.23.3 SPI (UNICOMM)
    24. 8.24 WWDT
    25. 8.25 Timers (TIMx)
    26. 8.26 LCD
    27. 8.27 Device Analog Connections
    28. 8.28 Input/Output Diagrams
    29. 8.29 DEBUGSS
    30. 8.30 Serial Wire Debug Interface
    31. 8.31 Bootstrap Loader (BSL)
    32. 8.32 Device Factory Constants
    33. 8.33 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

3 Description

MSPM0L2116/7 and MSPM0L1126/7 microcontrollers (MCUs) are part of MSP's highly integrated, ultra-low-power 32-bit MSPM0 MCU family. The microcontrollers are based on the Arm®Cortex®-M0+ 32-bit core platform, operating at up to 32MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V.

The MSPM0L2116/7 and MSPM0L1126/7 devices provide up to 128KB embedded flash program memory with built in error correction code (ECC) and 12KB SRAM with ECC and parity protection. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2.1% to +1.6%, eliminating the need for an external crystal.

An ultra-low power segmented LCD controller (on MSPM0L2116/7 devices) supports driving LCD glass with up to 52 pins in a variety of mux and bias configurations, enabling low cost displays.

Flexible cybersecurity enablers can be used to support secure boot, IP protection (execute-only memory), key storage, and more. Hardware acceleration is provided for a variety of 128/256-bit AES symmetric cipher modes.

Additional features include a 3-channel DMA, CRC-16 accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.6Msps ADC with VDD as the voltage reference, a comparator with 8-bit reference DAC and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer with deadband and timer frequency up to 64MHz, three 16-bit general purpose timer, four basic timers, one windowed watchdog timer, and a variety of communication peripherals supporting up to three UART, two SPI, and two I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus.

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets the project's needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0L2116/7 and MSPM0L1126/7 MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 L-Series 32MHz Microcontrollers Technical Reference Manual.

Table 3-1 Package Information
PART NUMBER PACKAGE PACKAGE SIZE
MSPM0L2117SPMR PM (LQFP, 64) 12mm × 12mm
MSPM0L2116SPMR
MSPM0L1127SPMR
MSPM0L1126SPMR
MSPM0L2117SPTR PT (LQFP, 48) 9mm × 9mm
MSPM0L2116SPTR
MSPM0L1127SPTR
MSPM0L1126SPTR
MSPM0L2117SRGZR RGZ (VQFN, 48) 7mm × 7mm
MSPM0L2116SRGZR
MSPM0L1127SRGZR
MSPM0L1126SRGZR
MSPM0L2117SRHBR RHB (VQFN, 32) 5mm x 5mm
MSPM0L2116SRHBR
MSPM0L1127SRHBR
MSPM0L1126SRHBR
MSPM0L2117S28DGSR DGS (VSSOP, 28) 7.1mm × 4.9mm
MSPM0L2116S28DGSR
MSPM0L1127SDGS28R
MSPM0L1126SDGS28R
MSPM0L2117SRUYR RUY (WQFN, 28) 4mm x 4mm
MSPM0L2116SRUYR
MSPM0L1127SRUYR
MSPM0L1126SRUYR
MSPM0L2117SRGER RGE (VQFN, 24) 4mm × 4mm
MSPM0L2116SRGER
MSPM0L1127SRGER
MSPM0L1126SRGER