SLASFN5 December   2025 MSPM0L1126 , MSPM0L1127 , MSPM0L2116 , MSPM0L2117

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 Low Frequency Crystal/Clock
      4. 7.9.4 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Linearity Parameters
      3. 7.12.3 Switching Characteristics
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Electrical Characteristics
      2. 7.14.2 Voltage Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 LCD
    17. 7.17 I2C
      1. 7.17.1 I2C Characteristics
      2. 7.17.2 I2C Filter
      3. 7.17.3 I2C Timing Diagram
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 Emulation and Debug
      1. 7.21.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA Trigger Mapping
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripherals Summary
      3. 8.7.3 Interrupt Vector Number
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 LFSS
    15. 8.15 IWDT
    16. 8.16 RTC_B
    17. 8.17 VREF
    18. 8.18 COMP
    19. 8.19 Security
    20. 8.20 AESADV
    21. 8.21 CRC
    22. 8.22 Keystore
    23. 8.23 UNICOMM (UART/I2C/SPI)
      1. 8.23.1 UART (UNICOMM)
      2. 8.23.2 I2C (UNICOMM)
      3. 8.23.3 SPI (UNICOMM)
    24. 8.24 WWDT
    25. 8.25 Timers (TIMx)
    26. 8.26 LCD
    27. 8.27 Device Analog Connections
    28. 8.28 Input/Output Diagrams
    29. 8.29 DEBUGSS
    30. 8.30 Serial Wire Debug Interface
    31. 8.31 Bootstrap Loader (BSL)
    32. 8.32 Device Factory Constants
    33. 8.33 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

7.8 Timing Characteristics

VDD=3.3V, Ta=25 ℃ (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Wakeup Timing
tWAKE, SLEEP Wakeup time from SLEEP0 to RUN (1) 2 cycles
Wakeup time from SLEEP1 to RUN (1) 1.6 us
Wakeup time from SLEEP2 to RUN (1) 2.2 us
tWAKE, STOP Wakeup time from STOP0 to RUN (SYSOSC enabled) (1) 7.2 us
Wakeup time from STOP2 to RUN (SYSOSC disabled) (1) 8.1 us
tWAKE, STBY Wakeup time from STANDBY0 to RUN (1) 10 us
Wakeup time from STANDBY1 to RUN (1) 10
Wakeup time from SHUTDOWN to RUN Fast boot enabled 283 us
Wakeup time from SHUTDOWN to RUN Fast boot disabled 310 us
Asynchronous Fast Clock Request Timing
tDELAY Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is SLEEP1 0.3
Mode is SLEEP2 0.9 us
Mode is STOP0 0.9 us
Mode is STOP2 0.9 us
Mode is STANDBY1 3.1 us
Mode is STANDBY0 3.1 us
Startup Timing
tSTART, RESET Device cold start-up time from reset/power-up (2) Fast boot enabled 284 us
Fast boot disabled 325 us
NRST Timing
tRST, BOOTRST Minimum pulse length on NRST pin to generate BOOTRST ULPCLK≥4MHz 2 us
ULPCLK=32kHz 100 us
tRST, POR Minimum pulse length on NRST pin to generate POR 1 s
(1) The wake-up time is measured from the edge of an external signal (GPIO wake-up event) to the time that the first CPU instruction is executed, with the GPIO glitch filter disabled (FILTEREN=0x0) and fast wake enabled (FASTWAKEONLY=1)
(2) The start-up time is measured from the time that VDD crosses VBOR0+ (cold start-up) to the time that the first instruction of the user program is executed.