SLASFN5 December   2025 MSPM0L1126 , MSPM0L1127 , MSPM0L2116 , MSPM0L2117

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 Low Frequency Crystal/Clock
      4. 7.9.4 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Linearity Parameters
      3. 7.12.3 Switching Characteristics
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Electrical Characteristics
      2. 7.14.2 Voltage Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 LCD
    17. 7.17 I2C
      1. 7.17.1 I2C Characteristics
      2. 7.17.2 I2C Filter
      3. 7.17.3 I2C Timing Diagram
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 Emulation and Debug
      1. 7.21.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA Trigger Mapping
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripherals Summary
      3. 8.7.3 Interrupt Vector Number
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 LFSS
    15. 8.15 IWDT
    16. 8.16 RTC_B
    17. 8.17 VREF
    18. 8.18 COMP
    19. 8.19 Security
    20. 8.20 AESADV
    21. 8.21 CRC
    22. 8.22 Keystore
    23. 8.23 UNICOMM (UART/I2C/SPI)
      1. 8.23.1 UART (UNICOMM)
      2. 8.23.2 I2C (UNICOMM)
      3. 8.23.3 SPI (UNICOMM)
    24. 8.24 WWDT
    25. 8.25 Timers (TIMx)
    26. 8.26 LCD
    27. 8.27 Device Analog Connections
    28. 8.28 Input/Output Diagrams
    29. 8.29 DEBUGSS
    30. 8.30 Serial Wire Debug Interface
    31. 8.31 Bootstrap Loader (BSL)
    32. 8.32 Device Factory Constants
    33. 8.33 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

7.4 Thermal Information

THERMAL METRIC(1) PACKAGE VALUE UNIT
RθJA Junction-to-ambient thermal resistance LQFP-64 (PM) 56.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 24.9 °C/W
RθJB Junction-to-board thermal resistance 37.7 °C/W
ΨJT Junction-to-top characterization parameter 2.0 °C/W
ΨJB Junction-to-board characterization parameter 37.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance LQFP-48 (PT) 63.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.5 °C/W
RθJB Junction-to-board thermal resistance 41.0 °C/W
ΨJT Junction-to-top characterization parameter 3.2 °C/W
ΨJB Junction-to-board characterization parameter 40.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance VQFN-48 (RGZ) 31.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 22.7 °C/W
RθJB Junction-to-board thermal resistance 14.9 °C/W
ΨJT Junction-to-top characterization parameter 1.0 °C/W
ΨJB Junction-to-board characterization parameter 14.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.6 °C/W
RθJA Junction-to-ambient thermal resistance VQFN-32 (RHB) 36.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28.0 °C/W
RθJB Junction-to-board thermal resistance 16.0 °C/W
ΨJT Junction-to-top characterization parameter 0.9 °C/W
ΨJB Junction-to-board characterization parameter 16.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.6 °C/W
RθJA Junction-to-ambient thermal resistance VSSOP-28 (DGS28) 74.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.6 °C/W
RθJB Junction-to-board thermal resistance 35.8 °C/W
ΨJT Junction-to-top characterization parameter 1.7 °C/W
ΨJB Junction-to-board characterization parameter 35.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance WQFN-28 (RUY) 44.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.1 °C/W
RθJB Junction-to-board thermal resistance 20.0 °C/W
ΨJT Junction-to-top characterization parameter 0.8 °C/W
ΨJB Junction-to-board characterization parameter 20.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.5 °C/W
RθJA Junction-to-ambient thermal resistance VQFN-24 (RGE) 44.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 37.2 °C/W
RθJB Junction-to-board thermal resistance 21.2 °C/W
ΨJT Junction-to-top characterization parameter 1.2 °C/W
ΨJB Junction-to-board characterization parameter 21.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.