SLASFO8 July   2025 AFE53004W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics, Voltage Output
    6. 5.6  Electrical Characteristics, Current Output
    7. 5.7  Electrical Characteristics, Comparator Mode
    8. 5.8  Electrical Characteristics, ADC Input
    9. 5.9  Electrical Characteristics, General
    10. 5.10 Timing Requirements, I2C Standard Mode
    11. 5.11 Timing Requirements, I2C Fast Mode
    12. 5.12 Timing Requirements, I2C Fast Mode Plus
    13. 5.13 Timing Requirements, SPI Write Operation
    14. 5.14 Timing Requirements, SPI Read and Daisy Chain Operation (FSDO = 0)
    15. 5.15 Timing Requirements, SPI Read and Daisy Chain Operation (FSDO = 1)
    16. 5.16 Timing Requirements, GPIO
    17. 5.17 Timing Diagrams
    18. 5.18 Typical Characteristics: Voltage Output
    19. 5.19 Typical Characteristics: Current Output
    20. 5.20 Typical Characteristics: ADC
    21. 5.21 Typical Characteristics: Comparator
    22. 5.22 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Analog-Front-End Converter (AFE) Architecture
      2. 6.3.2 Digital Input/Output
      3. 6.3.3 Nonvolatile Memory (NVM)
    4. 6.4 Device Functional Modes
      1. 6.4.1  Voltage-Output Mode
        1. 6.4.1.1 Voltage Reference and DAC Transfer Function
          1. 6.4.1.1.1 Internal Reference
          2. 6.4.1.1.2 External Reference
          3. 6.4.1.1.3 Power-Supply as Reference
      2. 6.4.2  Current-Output Mode
      3. 6.4.3  Analog-to-Digital Converter (ADC) Mode
      4. 6.4.4  Comparator Mode
        1. 6.4.4.1 Programmable Hysteresis Comparator
        2. 6.4.4.2 Programmable Window Comparator
      5. 6.4.5  Programmable Slew-Rate Control
      6. 6.4.6  Fault-Dump Mode
      7. 6.4.7  High-Impedance Output and PROTECT Input
      8. 6.4.8  PMBus Compatibility Mode
      9. 6.4.9  Function Generation
        1. 6.4.9.1 Triangular Waveform Generation
        2. 6.4.9.2 Sawtooth Waveform Generation
        3. 6.4.9.3 Sine Waveform Generation
      10. 6.4.10 Device Reset and Fault Management
        1. 6.4.10.1 Power-On Reset (POR)
        2. 6.4.10.2 External Reset
        3. 6.4.10.3 Register-Map Lock
        4. 6.4.10.4 NVM Cyclic Redundancy Check (CRC)
          1. 6.4.10.4.1 NVM-CRC-FAIL-USER Bit
          2. 6.4.10.4.2 NVM-CRC-FAIL-INT Bit
      11. 6.4.11 Power-Down Mode
    5. 6.5 Programming
      1. 6.5.1 SPI Programming Mode
      2. 6.5.2 I2C Programming Mode
        1. 6.5.2.1 F/S Mode Protocol
        2. 6.5.2.2 I2C Update Sequence
          1. 6.5.2.2.1 Address Byte
          2. 6.5.2.2.2 Command Byte
        3. 6.5.2.3 I2C Read Sequence
      3. 6.5.3 General-Purpose Input/Output (GPIO) Modes
  8. 7 Register Map
    1. 7.1  NOP Register (address = 00h) [reset = 0000h]
    2. 7.2  DAC-X-MARGIN-HIGH Register (address = 01h, 07h, 0Dh, 13h) [reset = 0000h]
    3. 7.3  DAC-X-MARGIN-LOW Register (address = 02h, 08h, 0Eh, 14h) [reset = 0000h]
    4. 7.4  DAC-X-VOUT-CMP-CONFIG Register (address = 03h, 09h, 0Fh, 15h) [reset = 0000h]
    5. 7.5  DAC-X-IOUT-MISC-CONFIG Register (address = 04h, 0Ah, 10h, 16h) [reset = 0000h]
    6. 7.6  DAC-X-CMP-MODE-CONFIG Register (address = 05h, 0Bh, 11h, 17h) [reset = 0000h]
    7. 7.7  DAC-X-FUNC-CONFIG Register (address = 06h, 0Ch, 12h, 18h) [reset = 0000h]
    8. 7.8  DAC-X-DATA Register (address = 19h, 1Ah, 1Bh, 1Ch) [reset = 0000h]
    9. 7.9  ADC-CONFIG-TRIG Register (address = 1Dh) [reset = 0000h]
    10. 7.10 ADC-DATA Register (address = 1Eh) [reset = 0000h]
    11. 7.11 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
    12. 7.12 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
    13. 7.13 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
    14. 7.14 GENERAL-STATUS Register (address = 22h) [reset = 00h, DEVICE-ID, VERSION-ID]
    15. 7.15 CMP-STATUS Register (address = 23h) [reset = 0000h]
    16. 7.16 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
    17. 7.17 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
    18. 7.18 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
    19. 7.19 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
    20. 7.20 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
    21. 7.21 DAC-X-DATA-8BIT Register (address = 40h, 41h, 42h, 43h) [reset = 0000h]
    22. 7.22 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
    23. 7.23 PMBUS-PAGE Register [reset = 0300h]
    24. 7.24 PMBUS-OP-CMD-X Register [reset = 0000h]
    25. 7.25 PMBUS-CML Register [reset = 0000h]
    26. 7.26 PMBUS-VERSION Register [reset = 2200h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.9 Electrical Characteristics, General

all minimum and maximum values at TA = –40°C to +125°C and typical values at TA = 25°C, 1.7V ≤ VDD ≤ 5.5V, DAC reference tied to VDD, gain = 1 × in voltage output mode or ±250µA output range in current output mode, DAC output pin (OUT) loaded with resistive load (RL = 5kΩ to AGND) in voltage-output mode and capacitive load (CL = 200pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INTERNAL REFERENCE
Initial accuracy TA = 25°C 1.1979 1.212 1.224 V
Reference output temperature coefficient(1) (2) 50 ppm/°C 
EXTERNAL REFERENCE
VREF input impedance(1) (3) 192 kΩ-ch
EEPROM
Endurance(1) –40°C ≤ TA ≤ +85°C  20000 Cycles
TA = 125°C  1000
Data retention(1) TA = 25°C  50 Years
EEPROM programming write cycle time(1) 200 ms
Device boot-up time(1) Time taken from power valid (VDD ≥ 1.7V) to output valid state (output state as programmed in EEPROM), 0.5µF capacitor on the CAP pin 5 ms
DIGITAL INPUTS
Digital feedthrough Voltage output mode, DAC output static at midscale, fast mode plus, SCL toggling 20 nV-s
Pin capacitance Per pin 10 pF
POWER
IDD Current flowing into VDD Sleep mode, internal reference powered down, external reference at 5.5V 28 µA
IDD Current flowing into VDD(1) Sleep mode, internal reference enabled, additional current through internal reference 10 µA
IDD Current flowing into VDD(1) All channels enabled, internal reference enabled, additional current through internal reference per channel 12.5 µA
HIGH-IMPEDANCE OUTPUT
ILEAK Current flowing into VOUTX and VFBX DAC in Hi-Z output mode, 1.7V ≤ VDD ≤ 5.5V 10 nA
VDD = 0V, VOUT ≤ 1.5V, decoupling capacitor between VDD and AGND = 0.1μF 200 nA
VDD = 0V, 1.5V < VOUT ≤ 5.5V, decoupling capacitor between VDD and AGND = 0.1μF 500 nA
100kΩ between VDD and AGND, VOUT ≤ 1.25V, series resistance of 10kΩ at OUT pin ±2 µA
(1) Specified by design and characterization, not production tested.
(2) Measured at –40°C and +125°C and calculated the slope.
(3) Impedances for the DAC channels are connected in parallel.