SLASFO8 July   2025 AFE53004W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics, Voltage Output
    6. 5.6  Electrical Characteristics, Current Output
    7. 5.7  Electrical Characteristics, Comparator Mode
    8. 5.8  Electrical Characteristics, ADC Input
    9. 5.9  Electrical Characteristics, General
    10. 5.10 Timing Requirements, I2C Standard Mode
    11. 5.11 Timing Requirements, I2C Fast Mode
    12. 5.12 Timing Requirements, I2C Fast Mode Plus
    13. 5.13 Timing Requirements, SPI Write Operation
    14. 5.14 Timing Requirements, SPI Read and Daisy Chain Operation (FSDO = 0)
    15. 5.15 Timing Requirements, SPI Read and Daisy Chain Operation (FSDO = 1)
    16. 5.16 Timing Requirements, GPIO
    17. 5.17 Timing Diagrams
    18. 5.18 Typical Characteristics: Voltage Output
    19. 5.19 Typical Characteristics: Current Output
    20. 5.20 Typical Characteristics: ADC
    21. 5.21 Typical Characteristics: Comparator
    22. 5.22 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Analog-Front-End Converter (AFE) Architecture
      2. 6.3.2 Digital Input/Output
      3. 6.3.3 Nonvolatile Memory (NVM)
    4. 6.4 Device Functional Modes
      1. 6.4.1  Voltage-Output Mode
        1. 6.4.1.1 Voltage Reference and DAC Transfer Function
          1. 6.4.1.1.1 Internal Reference
          2. 6.4.1.1.2 External Reference
          3. 6.4.1.1.3 Power-Supply as Reference
      2. 6.4.2  Current-Output Mode
      3. 6.4.3  Analog-to-Digital Converter (ADC) Mode
      4. 6.4.4  Comparator Mode
        1. 6.4.4.1 Programmable Hysteresis Comparator
        2. 6.4.4.2 Programmable Window Comparator
      5. 6.4.5  Programmable Slew-Rate Control
      6. 6.4.6  Fault-Dump Mode
      7. 6.4.7  High-Impedance Output and PROTECT Input
      8. 6.4.8  PMBus Compatibility Mode
      9. 6.4.9  Function Generation
        1. 6.4.9.1 Triangular Waveform Generation
        2. 6.4.9.2 Sawtooth Waveform Generation
        3. 6.4.9.3 Sine Waveform Generation
      10. 6.4.10 Device Reset and Fault Management
        1. 6.4.10.1 Power-On Reset (POR)
        2. 6.4.10.2 External Reset
        3. 6.4.10.3 Register-Map Lock
        4. 6.4.10.4 NVM Cyclic Redundancy Check (CRC)
          1. 6.4.10.4.1 NVM-CRC-FAIL-USER Bit
          2. 6.4.10.4.2 NVM-CRC-FAIL-INT Bit
      11. 6.4.11 Power-Down Mode
    5. 6.5 Programming
      1. 6.5.1 SPI Programming Mode
      2. 6.5.2 I2C Programming Mode
        1. 6.5.2.1 F/S Mode Protocol
        2. 6.5.2.2 I2C Update Sequence
          1. 6.5.2.2.1 Address Byte
          2. 6.5.2.2.2 Command Byte
        3. 6.5.2.3 I2C Read Sequence
      3. 6.5.3 General-Purpose Input/Output (GPIO) Modes
  8. 7 Register Map
    1. 7.1  NOP Register (address = 00h) [reset = 0000h]
    2. 7.2  DAC-X-MARGIN-HIGH Register (address = 01h, 07h, 0Dh, 13h) [reset = 0000h]
    3. 7.3  DAC-X-MARGIN-LOW Register (address = 02h, 08h, 0Eh, 14h) [reset = 0000h]
    4. 7.4  DAC-X-VOUT-CMP-CONFIG Register (address = 03h, 09h, 0Fh, 15h) [reset = 0000h]
    5. 7.5  DAC-X-IOUT-MISC-CONFIG Register (address = 04h, 0Ah, 10h, 16h) [reset = 0000h]
    6. 7.6  DAC-X-CMP-MODE-CONFIG Register (address = 05h, 0Bh, 11h, 17h) [reset = 0000h]
    7. 7.7  DAC-X-FUNC-CONFIG Register (address = 06h, 0Ch, 12h, 18h) [reset = 0000h]
    8. 7.8  DAC-X-DATA Register (address = 19h, 1Ah, 1Bh, 1Ch) [reset = 0000h]
    9. 7.9  ADC-CONFIG-TRIG Register (address = 1Dh) [reset = 0000h]
    10. 7.10 ADC-DATA Register (address = 1Eh) [reset = 0000h]
    11. 7.11 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
    12. 7.12 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
    13. 7.13 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
    14. 7.14 GENERAL-STATUS Register (address = 22h) [reset = 00h, DEVICE-ID, VERSION-ID]
    15. 7.15 CMP-STATUS Register (address = 23h) [reset = 0000h]
    16. 7.16 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
    17. 7.17 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
    18. 7.18 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
    19. 7.19 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
    20. 7.20 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
    21. 7.21 DAC-X-DATA-8BIT Register (address = 40h, 41h, 42h, 43h) [reset = 0000h]
    22. 7.22 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
    23. 7.23 PMBUS-PAGE Register [reset = 0300h]
    24. 7.24 PMBUS-OP-CMD-X Register [reset = 0000h]
    25. 7.25 PMBUS-CML Register [reset = 0000h]
    26. 7.26 PMBUS-VERSION Register [reset = 2200h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.6 Electrical Characteristics, Current Output

all minimum and maximum values at TA = –40°C to +125°C and typical values at TA = 25°C, 1.7V ≤ VDD ≤ 5.5V, ±250µA output range, and digital inputs at VDD or AGND (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
STATIC PERFORMANCE
Resolution 8 Bits
INL Integral nonlinearity DAC codes between 0d and 255d –1 1 LSB
DNL Differential nonlinearity DAC codes between 0d and 255d –1 1 LSB
Offset error DAC output ranges: ±25µA, ±50µA, ±125µA, and ±250µA; DAC at midscale ±1 %FSR
Gain error DAC output ranges: ±25µA, ±50µA, ±125µA, and ±250µA; DAC codes between 0d and 255d ±1.3 %FSR
OUTPUT
Output compliance voltage(1) DAC output ranges: ±25µA, ±50µA, ±125µA, and ±250µA; to VDD and to AGND 400 mV
ZO IOUT dc output impedance(2) DAC at midscale, DAC output kept at VDD/2 60 MΩ
Power supply rejection ratio (dc) DAC at midscale, all bipolar ranges, VDD changed from 4.5V to 5.5V 0.23 LSB/V
DYNAMIC PERFORMANCE
tsett Output current settling time 1/4 to 3/4 scale and 3/4 to 1/4 scale settling to 1 LSB at 8-bit resolution, VDD = 5.5V, common-mode voltage at OUTx pin is VDD/2 60 µs
Vn Output noise current (peak to peak) 0.1Hz to 10Hz, DAC at midscale,
VDD = 5.5V, ±250µA output range		 150 nAPP
Output noise density f = 1kHz, DAC at midscale,
VDD = 5.5V, ±250µA output range		 1 nA/√Hz
Power supply rejection ratio (ac)(3) ±250µA output range, 200mV 50Hz or 60Hz sine wave superimposed on power-supply voltage, DAC at midscale 0.65 LSB/V
POWER
IDD Current flowing into VDD(3) (4) Normal operation, DACs at full scale, ±25µA output range, digital pins static 42 50 µA/ch
Normal operation, DACs at full scale, ±50µA output range, digital pins static 56 70
Normal operation, DACs at full scale, ±125µA output range, digital pins static 98 120
Normal operation, DACs at full scale, ±250µA output range, digital pins static 167 200
(1) Measured between DAC codes 0d and 255d.
(2) Specified by design and characterization, not production tested.
(3) The current flowing into VDD does not account for the load current sourced or sunk on the OUTx pins. VREF pin is connected to VDD.
(4) The total power consumption is calculated by IDD × (total number of channels powered on) + (sleep-mode current).