SLAZ741D March   2023  – August 2025 MSPM0L1105 , MSPM0L1106 , MSPM0L1303 , MSPM0L1304 , MSPM0L1305 , MSPM0L1306 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346

 

  1.   1
  2.   Abstract
  3. 1Functional Advisories
  4. 2Preprogrammed Software Advisories
  5. 3Debug Only Advisories
  6. 4Fixed by Compiler Advisories
  7. 5Device Nomenclature
    1. 5.1 Device Symbolization and Revision Identification
  8. 6Advisory Descriptions
    1. 6.1  ADC_ERR_01
    2. 6.2  ADC_ERR_02
    3. 6.3  ADC_ERR_03
    4. 6.4  ADC_ERR_04
    5. 6.5  ADC_ERR_05
    6. 6.6  ADC_ERR_06
    7. 6.7  COMP_ERR_01
    8. 6.8  COMP_ERR_02
    9. 6.9  COMP_ERR_03
    10. 6.10 COMP_ERR_05
    11. 6.11 CPU_ERR_01
    12. 6.12 CPU_ERR_02
    13. 6.13 CPU_ERR_03
    14. 6.14 FLASH_ERR_02
    15. 6.15 FLASH_ERR_04
    16. 6.16 FLASH_ERR_05
    17. 6.17 FLASH_ERR_06
    18. 6.18 GPIO_ERR_01
    19. 6.19 GPIO_ERR_02
    20. 6.20 GPIO_ERR_03
    21. 6.21 I2C_ERR_01
    22. 6.22 I2C_ERR_02
    23. 6.23 I2C_ERR_03
    24. 6.24 I2C_ERR_04
    25. 6.25 I2C_ERR_05
    26. 6.26 I2C_ERR_06
    27. 6.27 I2C_ERR_07
    28. 6.28 I2C_ERR_08
    29. 6.29 I2C_ERR_09
    30. 6.30 I2C_ERR_10
    31. 6.31 PMCU_ERR_01
    32. 6.32 PMCU_ERR_02
    33. 6.33 PMCU_ERR_03
    34. 6.34 PMCU_ERR_13
    35. 6.35 PWREN_ERR_01
    36. 6.36 RST_ERR_01
    37. 6.37 SPI_ERR_01
    38. 6.38 SPI_ERR_03
    39. 6.39 SPI_ERR_04
    40. 6.40 SPI_ERR_05
    41. 6.41 SPI_ERR_06
    42. 6.42 SPI_ERR_07
    43. 6.43 SYSOSC_ERR_01
    44. 6.44 SYSOSC_ERR_02
    45. 6.45 TIMER_ERR_01
    46. 6.46 TIMER_ERR_04
    47. 6.47 TIMER_ERR_06
    48. 6.48 UART_ERR_01
    49. 6.49 UART_ERR_02
    50. 6.50 UART_ERR_04
    51. 6.51 UART_ERR_05
    52. 6.52 UART_ERR_06
    53. 6.53 UART_ERR_07
    54. 6.54 UART_ERR_08
    55. 6.55 UART_ERR_09
    56. 6.56 VREF_ERR_01
  9. 7Revision History

5 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully qualified production devices (MSP).

XMS – Experimental device that is not necessarily representative of the final device's electrical specifications

MSP – Fully qualified production device

Support tool naming prefixes:

X: Development-support product that has not yet completed Texas Instruments internal qualification testing.

null: Fully-qualified development-support product.

XMS devices and X development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature range, package type, and distribution format.