SLLA475 December   2020 TCAN1144-Q1 , TCAN1146-Q1

 

  1. 1TCAN1144-Q1 and TCAN1146-Q1 Functional Safety Manual
  2. 2Trademarks
  3. 3Introduction
  4. 4TCAN114x-Q1 Hardware Component Functional Safety Capability
  5. 5Development Process for Management of Systematic Faults
    1. 5.1 TI New-Product Development Process
  6. 6TCAN1144-Q1 and TCAN1146-Q1 Component Overview
    1. 6.1 Targeted Applications
    2. 6.2 Hardware Component Functional Safety Concept
    3. 6.3 Functional Safety Constraints and Assumptions
  7. 7Description of Hardware Component Parts
    1. 7.1 CAN Transceiver
    2. 7.2 Digital Core
    3. 7.3 EEPROM
    4. 7.4 Power Control IP
      1. 7.4.1 Voltage Monitors
    5. 7.5 Thermal Shut Down
    6. 7.6 Digital Input/Outputs
  8. 8TCAN1144-Q1 and TCAN1146-Q1 Management of Random Faults
    1. 8.1 Fault Reporting
    2. 8.2 Functional Safety Mechanism Categories
    3. 8.3 Description of Functional Safety Mechanisms
      1. 8.3.1 CAN Communication
        1. 8.3.1.1 SM-1: CAN bus fault diagnostic
        2. 8.3.1.2 SM-2: Thermal shutdown; TSD
        3. 8.3.1.3 SM-3: CAN bus short circuit limiter, IOS
        4. 8.3.1.4 SM-4: CAN TXD pin dominant state timeout; tTXD_DTO
        5. 8.3.1.5 SM-17: CAN protocol
      2. 8.3.2 Supply Voltage Rail Monitoring
        1. 8.3.2.1 SM-5: VCC undervoltage; UVCC
        2. 8.3.2.2 SM-6: VSUP supply undervoltage; UVSUP
        3. 8.3.2.3 SM-7: VIO supply undervoltage; UVIO
      3. 8.3.3 SPI/Processor Communication
        1. 8.3.3.1 SM-8: Timout, Window or Q&A watchdog error - Normal mode
        2. 8.3.3.2 SM-9: SPI communication error; SPIERR
        3. 8.3.3.3 SM-10: Scratchpad write/read
        4. 8.3.3.4 SM-11: Sleep Wake Error Timer; tINACTIVE
      4. 8.3.4 Device Internal EEPROM
        1. 8.3.4.1 SM-12: Internal memory CRC; CRC_EEPROM
      5. 8.3.5 Floating Pins
        1. 8.3.5.1 SM-13: SCLK internal pull-up to VIO
        2. 8.3.5.2 SM-14: SDI internal pull-up to VIO
        3. 8.3.5.3 SM-15: nCS internal pull-up to VIO
        4. 8.3.5.4 SM-16: TXD internal pull-up to VIO
          1.        B Revision History

Digital Input/Outputs

The TCAN1144-Q1 and TCAN1146-Q1 has 6 digital I/O pins, four of which are used to implement the SPI communications and the other two are utilized for the TXD and RXD signals for the CAN. These digital I/Os operate on the voltage provided on the VIO supply pin, eliminating the need for external level shifting of the signals. Four of these input pins have integrated pull-up resistors that weakly biases them.