10 Revision History
Changes from Revision D (December 2024) to Revision E (December 2024)
- Changed the VSSOP (DSG) package to the VSSOP (DGS) package
throughout the data sheetGo
Changes from Revision C (January 2023) to Revision D (December 2024)
- Changed the Device Information table to the Package
Information tableGo
- Added the VSSOP (DSG) package to the data sheetGo
- Added Note 2 to the ESD Ratings, IEC Specifications
Go
Changes from Revision B (August 2021) to Revision C (January 2023)
- Changed the ESD Ratings - IEC Specifications table note to include the DB packageGo
- Changed the values of R θJA in the Thermal Information table for the DB packageGo
Changes from Revision A (September 2009) to Revision B (August 2021)
- Updated the list of Applications.Go
- Deleted the Ordering Information tableGo
- Added the Device Information table, the Pin Configuration
and Functions, the Detailed Description section, the
Application and Implementation sectionGo
- Deleted the Package thermal impedance from the Absolute Maximum
Ratings
Go
- Changed the ESD Ratings tableGo
- Added the ESD Ratings - IEC Specifications tableGo
- Added the Thermal Information tableGo
- Changed the value of R θJA for PW package (previously in the Absolute Maximum Ratings table), and added additional thermal parameters for all packages in the Thermal Information table.Go