SLLSFV3 December   2025 ISO6041

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics-5V Supply
    10. 6.10 Supply Current Characteristics-5V Supply
    11. 6.11 Electrical Characteristics-3.3V Supply
    12. 6.12 Supply Current Characteristics-3.3V Supply
    13. 6.13 Electrical Characteristics-2.5V Supply 
    14. 6.14 Supply Current Characteristics-2.5V Supply
    15. 6.15 Electrical Characteristics-1.8V Supply 
    16. 6.16 Supply Current Characteristics-1.8V Supply
    17. 6.17 Switching Characteristics-5V Supply
    18. 6.18 Switching Characteristics-3.3V Supply
    19. 6.19 Switching Characteristics-2.5V Supply
    20. 6.20 Switching Characteristics-1.8V Supply
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
    6. 8.6 Overvoltage Tolerant Input
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Device Nomenclature
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     57
    2. 12.1 Tape and Reel Information

6.20 Switching Characteristics-1.8V Supply

VCC1 = VCC2 = 1.8V ±5% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time at 100kbps

See Section 7		 14.5 ns
PWD Pulse width distortion(1) |tPHL – tPLH| 1.2
tsk(o) Channel-to-channel output skew time(2) Same-direction channels 1.2
Opposite-direction channels 1.2
tsk(pp) Part-to-part skew time(3) 5
tr Output signal rise time See Section 7  5
tf Output signal fall time 5
tPHZ Disable propagation delay, high-to-high impedance output 44
tPLZ Disable propagation delay, low-to-high impedance output 44
tPZH Enable propagation delay, high impedance-to-high output for device versions with Enable (EN) See Section 7  41 ns
tPZL Enable propagation delay, high impedance-to-low output for device versions with Enable (EN) 44
tPU Time from VCC UVLO to valid output data VCC ramp < 1µs 80 µs
tDO Default output delay time from input power loss Measured from the time VCC goes below VCC_UVLO–(MIN). See Section 7  20 µs
tie Time interval error  216 – 1 PRBS data at 200Mbps, CL as defined in Recommended Operating Conditions, one channel switching  195 ps
tJCLK(RMS) Clock Jitter (RMS)  10MHz clock input, rising/falling edges, CL as defined in Recommended Operating Conditions, one channel switching   3.6 5 ps
(1) Also known as pulse skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.