SLLSFV3B December   2025  – August 2026 ISO6040 , ISO6041 , ISO6042

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   5
  6. 4 Device Comparison
  7. 5 Pin Configuration and Functions
  8. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics-5V Supply
    10. 6.10 Supply Current Characteristics-5V Supply
    11. 6.11 Electrical Characteristics-3.3V Supply
    12. 6.12 Supply Current Characteristics-3.3V Supply
    13. 6.13 Electrical Characteristics-2.5V Supply 
    14. 6.14 Supply Current Characteristics-2.5V Supply
    15. 6.15 Electrical Characteristics-1.8V Supply 
    16. 6.16 Supply Current Characteristics-1.8V Supply
    17. 6.17 Switching Characteristics-5V Supply
    18. 6.18 Switching Characteristics-3.3V Supply
    19. 6.19 Switching Characteristics-2.5V Supply
    20. 6.20 Switching Characteristics-1.8V Supply
    21. 6.21 Insulation Characteristics Curves
    22. 6.22 Typical Characteristics
  9.   31
  10. 7 Parameter Measurement Information
  11. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
    6. 8.6 Overvoltage Tolerant Input
  12. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  13. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Device Nomenclature
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  14. 11Revision History
  15. 12Mechanical, Packaging, and Orderable Information
    1.     62
    2.     63
    3.     64

1 Features

  • Functional Safety-Capable (Planned)
    • Documentation available to aid IEC 61508 system design
  • Supports High Bandwidth and Clock Sensitive Applications
    • Up to 200Mbps data rate
    • Low Propagation Delay: 9ns maximum at 5V, 10ns maximum at 3.3V
    • SPI up to: 27.75MHz at 5V, 25MHz at 3.3V
    • Low Pulse Width Distortion: 1.2ns maximum at 5V, 1.2ns maximum at 3.3V
    • Low Jitter: 7ps (RMS) typical supports low impact to ADC and DAC SNR for the sample clock signal
    • Low Channel to Channel Skew: 1.2ns maximum at 5V, 1.2ns maximum at 3.3V
    • Low Part to Part Skew: 3ns maximum at 5V, 3ns maximum at 3.3V
  • Supports High Channel Density Applications:
    • Low Power: 0.635mA maximum per channel at 1Mbps and 3.3V
    • Small Footprint Packages: SSOP (DBQ-16) , Wide-SSOP (DFP-16)
  • Robust SiO2 isolation barrier:
    • High lifetime at up to 1061VRMS and 1500VDC working voltage
    • Wide temperature range: –40°C to 125°C
    • Up to 5000VRMS isolation rating
    • Up to 10.4kV surge capability
    • Up to ±175kV/μs typical CMTI
  • Supply range: 1.71V to 5.5V
  • Overvoltage tolerant inputs
  • Default output high (ISO604xH) and low (ISO604xL) options
  • Robust electromagnetic compatibility (EMC)
    • System-level ESD, EFT, and surge immunity
    • Low emissions
  • Safety-Related Certifications (Planned):
    • DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 and CSA CAS Notice No. 5A
    • IEC 62368-1, IEC 61010-1 and GB 4943.1 certifications