SLOS198B August   1997  – July 2025 TLV2731

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Rating Table
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics, VDD = 3V
    5. 5.5 Operating Characteristics, VDD = 3V
    6. 5.6 Electrical Characteristics, VDD = 5V
    7. 5.7 Operating Characteristics, VDD = 5V
    8. 5.8 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Driving Large Capacitive Loads
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

3 Description

The TLV2731 is a single low-voltage operational amplifier available in the SOT-23 package. The TLV2731 offers 2MHz of bandwidth and 1.6V/μs of slew rate for applications requiring good ac performance. The device exhibits rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2731 is fully characterized at 3V and 5V and is optimized for low-voltage applications.

The TLV2731, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels combined with 3V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600Ω loads for telecom applications.

With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, and minimizes noise pick-up from long PCB traces.

Package Information
PART NUMBER(1) PACKAGE(2) PACKAGE SIZE(3)
TLV2731 DBV (SOT-23, 5) 2.9mm × 2.8mm
(1) For more information, see Section 9.
(2) The DBV package available in tape and reel only.
(3) The package size (length × width) is a nominal value and includes pins, where applicable.
Device Information
TA(1) VIOMAX AT 25°C PACKAGED DEVICES
SOT-23 (DBV)
0°C to 70°C 3mV TLV2731CDBV
–40°C to +85°C 3mV TLV2731IDBV
(1) Chip forms are tested at TA = 25°C only.
TLV2731 Extending Capacitive Load Drive With the TLV2731 Extending Capacitive Load Drive With the TLV2731