SLUSFM5 March   2025 BQ76907-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information BQ76907-Q1
    5. 6.5  Supply Current
    6. 6.6  Digital I/O
    7. 6.7  REGOUT LDO
    8. 6.8  Voltage References
    9. 6.9  Coulomb Counter
    10. 6.10 Coulomb Counter Digital Filter
    11. 6.11 Current Wake Detector
    12. 6.12 Analog-to-Digital Converter
    13. 6.13 Cell Voltage Measurement Accuracy
    14. 6.14 Cell Balancing
    15. 6.15 Internal Temperature Sensor
    16. 6.16 Thermistor Measurement
    17. 6.17 Hardware Overtemperature Detector
    18. 6.18 Internal Oscillator
    19. 6.19 Charge and Discharge FET Drivers
    20. 6.20 Comparator-Based Protection Subsystem
    21. 6.21 Timing Requirements - I2C Interface, 100kHz Mode
    22. 6.22 Timing Requirements - I2C Interface, 400kHz Mode
    23. 6.23 Timing Diagram
    24. 6.24 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Configuration
      1. 7.3.1 Commands and Subcommands
      2. 7.3.2 Configuration Using OTP or Registers
      3. 7.3.3 Device Security
    4. 7.4 Device Hardware Features
      1. 7.4.1  Voltage ADC
      2. 7.4.2  Coulomb Counter and Digital Filters
      3. 7.4.3  Protection FET Drivers
      4. 7.4.4  Voltage References
      5. 7.4.5  Multiplexer
      6. 7.4.6  LDOs
      7. 7.4.7  Standalone Versus Host Interface
      8. 7.4.8  ALERT Pin Operation
      9. 7.4.9  Low Frequency Oscillator
      10. 7.4.10 I2C Serial Communications Interface
    5. 7.5 Measurement Subsystem
      1. 7.5.1 Voltage Measurement
        1. 7.5.1.1 Voltage ADC Scheduling
        2. 7.5.1.2 Unused VC Pins
        3. 7.5.1.3 General Purpose ADCIN Functionality
      2. 7.5.2 Current Measurement and Charge Integration
      3. 7.5.3 Internal Temperature Measurement
      4. 7.5.4 Thermistor Temperature Measurement
      5. 7.5.5 Factory Trim and Calibration
    6. 7.6 Protection Subsystem
      1. 7.6.1 Protections Overview
      2. 7.6.2 Primary Protections
      3. 7.6.3 CHG Detector
      4. 7.6.4 Cell Open-Wire Protection
      5. 7.6.5 Diagnostic Checks
    7. 7.7 Cell Balancing
    8. 7.8 Device Operational Modes
      1. 7.8.1 Overview of Operational Modes
      2. 7.8.2 NORMAL Mode
      3. 7.8.3 SLEEP Mode
      4. 7.8.4 DEEPSLEEP Mode
      5. 7.8.5 SHUTDOWN Mode
      6. 7.8.6 CONFIG_UPDATE Mode
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plot
      4. 8.2.4 Random Cell Connection Support
      5. 8.2.5 Startup Timing
      6. 8.2.6 FET Driver Turn-Off
      7. 8.2.7 Usage of Unused Pins
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

SHUTDOWN Mode

SHUTDOWN mode is the lowest power mode of the BQ76907-Q1, which can be used for shipping or long-term storage. In this mode, the device loses all register state information, the internal logic is powered down, and the protection FETs are all disabled, so no voltage is provided at the battery pack terminals. All protections are disabled, all voltage, current, and temperature measurements are disabled, and no communications are supported. When the device exits SHUTDOWN, it will read parameters stored in OTP (which TI programmed), which effectively sets the default values for settings. After device powerup, settings can then be changed by the host writing device registers.

The device can enter SHUTDOWN mode when directed by the host via subcommand. It can also be configured to enter SHUTDOWN mode automatically based on the top of stack voltage or the minimum cell voltage. The shutdown based on cell voltage does not apply to cell input pins not used for actual cells.

While the BQ76907-Q1 is in NORMAL mode or SLEEP mode, the device can also be configured to enter SHUTDOWN mode if the internal temperature measurement exceeds a programmable threshold.

When the device is wakened from SHUTDOWN, it requires approximately 10ms for the internal circuitry to power up, load settings from OTP memory, perform initial measurements, evaluate those relative to enabled protections, and then to enable FETs if conditions and settings allow.

The BQ76907-Q1 integrates a hardware overtemperature detection circuit, which determines when the die temperature passes an excessive temperature of approximately 120°C. If this detector triggers, the device will automatically begin the sequence to enter SHUTDOWN, based on the configuration setting.

The BQ76907-Q1 will wake from SHUTDOWN if a voltage is applied at the TS or VC0 pins above a level of approximately 1.2V. If the shutdown sequence has been initiated, but the device detects the wakeup criteria are present, then the device will stay in a "soft shutdown" state until the wakeup criteria are removed. While in "soft shutdown," FETs are disabled, and protections and measurements are stopped. The device will exit "soft shutdown" when conditions allow the device to continue into SHUTDOWN mode. The host can abort the entry into SHUTDOWN mode via command, and the device will restart operation with a full reset.