SLUSG05 March   2025 UC2843L-Q1 , UC2844L-Q1 , UC2845L-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pulse-by-Pulse Current Limiting
      2. 7.3.2 Current Sense Circuit
      3. 7.3.3 Error Amplifier Configuration
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Oscillator
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Undervoltage Lockout (UVLO) Start-Up
      3. 7.4.3 UVLO Turnoff Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 UC2842A (UC284xL-Q1) Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Power Supply Recommendations
      5. 8.2.5 Layout
        1. 8.2.5.1 Layout Guidelines
        2. 8.2.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)D (SOIC)UNIT
8 PINS
RθJAJunction-to-ambient thermal resistance117.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance51.5°C/W
RθJBJunction-to-board thermal resistance61°C/W
ψJTJunction-to-top characterization parameter7.8°C/W
ψJBJunction-to-board characterization parameter60.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.