SLUUD39C May   2024  – August 2025 UCC33411-Q1 , UCC33421-Q1

 

  1.   1
  2.   Description
  3.   Features
    1.     Applications
  4.   5
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Device Information
      1. 1.3.1 U1 Component Selection
      2. 1.3.2 UCC33421-Q1 Pin Definition
    4. 1.4 Specification
  6. 2Hardware
    1. 2.1 EVM Setup and Operation
      1. 2.1.1 Recommended Test Equipment
      2. 2.1.2 External Connections for Easy Evaluation
      3. 2.1.3 Powering the EVM
        1. 2.1.3.1 Power on for Start-up
        2. 2.1.3.2 Power off for Shutdown
      4. 2.1.4 EVM Test Points
      5. 2.1.5 Oscilloscope Probes: Probing the EVM
  7. 3Implementation Results
    1. 3.1 Performance Data
      1. 3.1.1 Efficiency Data
      2. 3.1.2 Regulation Data
      3. 3.1.3 Startup Waveforms
      4. 3.1.4 Inrush Current
      5. 3.1.5 AC Ripple Voltage
      6. 3.1.6 Load Transient
      7. 3.1.7 VCC Short-Circuit
      8. 3.1.8 Thermal Performance
  8. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 Assembly and Printed Circuit Board (PCB)
    3. 4.3 Bill of Materials (BOM)
  9. 5Additional Information
    1. 5.1 Trademarks
  10. 6Revision History

4.2 Assembly and Printed Circuit Board (PCB)

The UCC33421EVM-092 is designed using a four-layer, FR4, PCB, fabricated with 1-ounce copper on all four layers. The EVM, PCB demonstrates the important use of ground planes and tented stitching vias for shielding and providing low impedance connection between GND layers. For higher density PCBs such as automotive traction inverters, the PCB can include several additional signal layers but similar design methodology must be applied as best as possible.

UCC33421EVM-092 Fully Assembled 3D Top ViewFigure 4-2 Fully Assembled 3D Top View
UCC33421EVM-092 PCB Top Layer, AssemblyFigure 4-4 PCB Top Layer, Assembly
UCC33421EVM-092 Ground Layer 3 Figure 4-6 Ground Layer 3
UCC33421EVM-092 Fully Assembled 3D Bottom ViewFigure 4-3 Fully Assembled 3D Bottom View
UCC33421EVM-092 Ground Layer 2 Figure 4-5 Ground Layer 2
UCC33421EVM-092 PCB Bottom Layer, Assembly (Mirrored View)Figure 4-7 PCB Bottom Layer, Assembly (Mirrored View)