3 Device and Test Board Information

The CDCLVP111-SEP is packaged in a 32-pin thermally enhanced qual flat package (HLQFP) as shown in Figure 3-1. The CDCLVP111-SEP evaluation module was used to evaluate the performance and characteristics of the CDCLVP111-SEP under heavy ion radiation as shown in Figure 3-2. The schematic is shown in Figure 3-3.

Figure 3-1 Photograph of Delidded CDCLVP111-SEP (Left) and Pinout Diagram (Right)

Note: The package was decapped to reveal the die face for all heavy-ion testing.

Figure 3-2 CDCLVP111-SEP EVM Top View

Figure 3-3 CDCLVP111-SEP EVM Schematic 1

Figure 3-4 CDCLVP111-SEP EVM Schematic 2

Figure 3-5 CDCLVP111-SEP EVM Schematic 3

Figure 3-6 CDCLVP111-SEP EVM Schematic 4

Figure 3-7 CDCLVP111-SEP EVM Schematic 5

Figure 3-8 CDCLVP111-SEP EVM Schematic 6