SLVSH43C July   2023  – May 2025 TSD03 , TSD05 , TSD12 , TSD15 , TSD18 , TSD24 , TSD36

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings - JEDEC Specification
    3. 5.3  ESD Ratings - IEC Specification
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics - TSD03
    7. 5.7  Electrical Characteristics - TSD05
    8. 5.8  Electrical Characteristics - TSD12
    9. 5.9  Electrical Characteristics - TSD15
    10. 5.10 Electrical Characteristics - TSD18
    11. 5.11 Electrical Characteristics - TSD24
    12. 5.12 Electrical Characteristics - TSD36
    13. 5.13 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Tape and Reel Information
    2. 9.2 Mechanical Data

5.5 Thermal Information

THERMAL METRIC (1) TSD03 TSD05 TSD12 / TSD15 / TSD18 / TSD24 / TSD36 UNIT
DYF (SOD-323) DYF (SOD-323) DYF (SOD-323)
2 PINS 2 PINS 2 PINS
RθJA Junction-to-ambient thermal resistance 739.2 672.0 693.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 287.7 230.5 254.7 °C/W
RθJB Junction-to-board thermal resistance 605.5 541.4 566.6 °C/W
ΨJT Junction-to-top characterization parameter 118.4 64.4 78.6 °C/W
ΨJB Junction-to-board characterization parameter 591.1 527.5 552.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.