SLVSHM2B March   2025  – October 2026 TPS2HC120-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Current and Voltage Conventions
      2. 7.3.2 Low Power Mode
        1. 7.3.2.1 Entry Into LPM
        2. 7.3.2.2 During LPM
        3. 7.3.2.3 Exiting LPM
      3. 7.3.3 Accurate Current Sense
      4. 7.3.4 Adjustable Current Limit
      5. 7.3.5 Inductive-Load Switching-Off Clamp
      6. 7.3.6 Fault Detection and Reporting
        1. 7.3.6.1 Diagnostic Enable Function
        2. 7.3.6.2 Multiplexing of Current Sense
        3. 7.3.6.3 FLT Reporting
        4. 7.3.6.4 Fault Table
      7. 7.3.7 Full Diagnostics
        1. 7.3.7.1 Short-to-GND and Overload Detection
        2. 7.3.7.2 Open-Load Detection
          1. 7.3.7.2.1 Channel On
          2. 7.3.7.2.2 Channel Off
        3. 7.3.7.3 Short-to-Battery Detection
        4. 7.3.7.4 Reverse-Polarity and Battery Protection
        5. 7.3.7.5 Thermal Fault Detection
          1. 7.3.7.5.1 Thermal Protection Behavior
      8. 7.3.8 Full Protections
        1. 7.3.8.1 UVLO Protection
        2. 7.3.8.2 Loss of GND Protection
        3. 7.3.8.3 Loss of Power Supply Protection
        4. 7.3.8.4 Reverse Battery Protection
        5. 7.3.8.5 Protection for MCU I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Working Modes
        1. 7.4.1.1 SLEEP
        2. 7.4.1.2 DIAGNOSTIC
        3. 7.4.1.3 ACTIVE
        4. 7.4.1.4 STANDBY DELAY
        5. 7.4.1.5 LOW POWER MODE
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 EMC Transient Disturbances Test
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
        1. 8.5.2.1 Without a GND Network
        2. 8.5.2.2 With a GND Network
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.3.2.3 Exiting LPM

The device exits LPM if any of four conditions is met:

  • Load current increases slowly: If the load current increases beyond ILPM,exit slowly, the device wakes up and pulls the LPM pin low to signal the device is no longer in low power mode. The output voltage droop is minimal.
    TPS2HC120-Q1 Exiting LPM With Load Current Slow Increase Figure 7-5 Exiting LPM With Load Current Slow Increase
  • Load current increases rapidly (short-circuit): If the load current increases rapidly beyond IPKLPM,SC, the device shuts down to protect itself and come back on within the tWAKE time in normal operation with full functionality. As the part comes back on, LPM pin is pulled LOW to represent that the part has come out of LPM. The FLT pin continues to be pulled low if the fault is still present after exiting LPM.
    TPS2HC120-Q1 Exiting LPM With Rapid Load Current Increase (Short-Circuit) Figure 7-6 Exiting LPM With Rapid Load Current Increase (Short-Circuit)
  • Any ENx is toggled (from ON to OFF or OFF to ON): If any channel is turned ON or turned OFF during LPM, the device wakes up and perform the desired action. Additionally, any toggling of ENx_AUX wakes up the device, even if it does not cause an ON/OFF transition. After the device wakes up, if the LPM entry conditions are still met, the part enters LPM again after tSTBY.
  • DIAG_EN is turned ON: if DIAG_EN goes high, the device goes into the DIAGNOSTIC mode which fully turns on the part so that all of the functionality works as intended in the DIAGNOSTIC state. If DIAG_EN goes back low, with all LPM entry conditions are met, the part goes back into LPM after tSTBY.

Any time the device comes out of LPM to ACTIVE state, the LPM pin is pulled LOW. If the system needs to wake up when the device comes out of LPM, the LPM pin can be used to send a wake up signal to the MCU. Otherwise the LPM pin can be ignored.