SLVSHM2B March   2025  – October 2026 TPS2HC120-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Current and Voltage Conventions
      2. 7.3.2 Low Power Mode
        1. 7.3.2.1 Entry Into LPM
        2. 7.3.2.2 During LPM
        3. 7.3.2.3 Exiting LPM
      3. 7.3.3 Accurate Current Sense
      4. 7.3.4 Adjustable Current Limit
      5. 7.3.5 Inductive-Load Switching-Off Clamp
      6. 7.3.6 Fault Detection and Reporting
        1. 7.3.6.1 Diagnostic Enable Function
        2. 7.3.6.2 Multiplexing of Current Sense
        3. 7.3.6.3 FLT Reporting
        4. 7.3.6.4 Fault Table
      7. 7.3.7 Full Diagnostics
        1. 7.3.7.1 Short-to-GND and Overload Detection
        2. 7.3.7.2 Open-Load Detection
          1. 7.3.7.2.1 Channel On
          2. 7.3.7.2.2 Channel Off
        3. 7.3.7.3 Short-to-Battery Detection
        4. 7.3.7.4 Reverse-Polarity and Battery Protection
        5. 7.3.7.5 Thermal Fault Detection
          1. 7.3.7.5.1 Thermal Protection Behavior
      8. 7.3.8 Full Protections
        1. 7.3.8.1 UVLO Protection
        2. 7.3.8.2 Loss of GND Protection
        3. 7.3.8.3 Loss of Power Supply Protection
        4. 7.3.8.4 Reverse Battery Protection
        5. 7.3.8.5 Protection for MCU I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Working Modes
        1. 7.4.1.1 SLEEP
        2. 7.4.1.2 DIAGNOSTIC
        3. 7.4.1.3 ACTIVE
        4. 7.4.1.4 STANDBY DELAY
        5. 7.4.1.5 LOW POWER MODE
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 EMC Transient Disturbances Test
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
        1. 8.5.2.1 Without a GND Network
        2. 8.5.2.2 With a GND Network
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision A (August 2025) to Revision B (October 2026)

  • Updated the title to include 2A and automotive featureGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed maximum selectable current limit from 5A to 4.7AGo
  • Added functional safety capable informationGo
  • Changed output load current when both channels are enabled from up to 2.5A to up to 2AGo
  • Changed selectable current limit settings maximum from 5A to 4.7AGo
  • Changed low RON from 120mΩ to 130mΩGo
  • Changed part number from TPS2HC120A to TPS2HC120A-Q1Go
  • Changed part number from TPS2HC120B to TPS2HC120B-Q1Go
  • Changed pin number 7 name from SEL to SEL0Go
  • Deleted FAULT from pin 9 FLTGo
  • Updated description for Thermal PadGo
  • Added inductive energy plots to typical characteristicsGo
  • Added Figure 7-2Go
  • Updated accurate current senseGo
  • Changed column one header from Allowed Resistor Value to Allowed Range of Resistor ValuesGo
  • Changed ILIM thresholds to correspond with new allowed range of resistor valuesGo
  • Changed allow range of resistor values open from > 60kΩ to > 87kΩGo
  • Updated inductive-load switching-off clampGo
  • Updated channel offGo
  • Deleted latch version from thermal protection behavior and Figure 7-19Go
  • Updated loss of device GNDGo
  • Updated loss of module GNDGo
  • Added IC to case 1Go
  • Changed from IC_GND to IC GNDGo
  • Updated Loss of BatteryGo
  • Updated SLEEPGo
  • Deleted FLT pin information from ACTIVEGo
  • Moved EMC Transient Disturbances Test from after Application Curves to after Application InformationGo
  • Changes CIC description from 100nF to 15nFGo
  • Added Figure 8-3Go

Changes from Revision * (March 2025) to Revision A (August 2025)

  • Changed TPS2HC120B from preview to production dataGo