SLVSI28 December   2025 TPS1HC04-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Thresholds
      2. 8.3.2  Accurate Current Sense
        1. 8.3.2.1 SNS Response Time
        2. 8.3.2.2 SNS Output Filter
        3. 8.3.2.3 Multiplexing of Current Sense Across Devices
      3. 8.3.3  Overcurrent Protection
        1. 8.3.3.1 Adjustable Current Limit
          1. 8.3.3.1.1 Current Limiting With Thermal Regulation
          2. 8.3.3.1.2 Current Limiting With No Thermal Regulation
          3. 8.3.3.1.3 Current Limit Foldback
          4. 8.3.3.1.4 Current Limit Accuracy
        2. 8.3.3.2 Thermal Shutdown
          1. 8.3.3.2.1 Relative Thermal Shutdown
          2. 8.3.3.2.2 Absolute Thermal Shutdown
      4. 8.3.4  Retry Protection Mechanism From Thermal Shutdown
      5. 8.3.5  Inductive-Load Switching-Off Clamp
      6. 8.3.6  Slower Slew Rate Option
      7. 8.3.7  Capacitive Load Charging
        1. 8.3.7.1 Adjustable Current Limiting for Inrush Control
        2. 8.3.7.2 Current Limit with Thermal Regulation for Capacitive Loads
        3. 8.3.7.3 Retry Thermal Shutdown Behavior for Capacitive Loads
        4. 8.3.7.4 Impact of DC Load on Capacitive Charging Capability
        5. 8.3.7.5 Device Capability
      8. 8.3.8  Bulb Charging
        1. 8.3.8.1 Non-Thermal Regulated Mode for Bulb Loads
        2. 8.3.8.2 Thermal Management During Bulb Inrush
        3. 8.3.8.3 Device Capability
      9. 8.3.9  Fault Detection and Reporting
        1. 8.3.9.1 Diagnostic Enable Function
        2. 8.3.9.2 FLT Reporting
        3. 8.3.9.3 FLT Timings
        4. 8.3.9.4 Fault Table
      10. 8.3.10 Full Diagnostics
        1. 8.3.10.1 Open-Load Detection
          1. 8.3.10.1.1 Channel On
          2. 8.3.10.1.2 Channel Off
        2. 8.3.10.2 Short-to-Battery Detection
        3. 8.3.10.3 Reverse-Polarity and Battery Protection
      11. 8.3.11 Full Protections
        1. 8.3.11.1 UVLO Protection
        2. 8.3.11.2 Loss of GND Protection
        3. 8.3.11.3 Loss of Power Supply Protection
        4. 8.3.11.4 Reverse Current Protection
        5. 8.3.11.5 Protection for MCU I/Os
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 EMC Transient Disturbances Test
      3. 9.2.3 Transient Thermal Performance
      4. 9.2.4 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
        1. 9.4.2.1 Without a GND Network
        2. 9.4.2.2 With a GND Network
      3. 9.4.3 Wettable Flank Package
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Retry Protection Mechanism From Thermal Shutdown

When a thermal shutdown occurs, the device shuts off and implements a retry protection mechamism to improve system reliability. Figure 8-19 explains how the device responds depending on the load current and duration of the overcurrent event.

For load current lower than current limit, device enters into infinite thermal shutdown retry cycles phase until the device recovers from the thermal shutdown fault. In this case, the device turn off time depends on cooling time needed with inherent 200μs delay.

TPS1HC04-Q1 Device Enters Into Infinite
                    Thermal Shutdown Retry Phase For Load Current (28A electronic load) Less Than
                    Current Limit (ILIM = GND) Figure 8-18 Device Enters Into Infinite Thermal Shutdown Retry Phase For Load Current (28A electronic load) Less Than Current Limit (ILIM = GND)

For load current higher than current limit, device implements a finite retry cycles phase protection mechanism based on the duration of the overcurrent event, that can trigger when either of the below fault conditions occur:

  1. Absolute thermal shutdown (TABS): TJ,FET > TABS

  2. Relative thermal shutdown (TREL): TJ,FET – TJ,CONTROLLER > TREL

  3. Circuit Breaker (ICB): A fast-trip protection that triggers when current exceeds the ICB threshold during a hot-short condition. This quickly turns off the channel to protect the internal MOSFET.

The finite retry cycles phase protection mechanism has below durations:

  1. Initial Retry Window (t < tRETRY_WINDOW):

    • After ICB or thermal shutdown triggers.
    • Retry attempts occur every tRETRY, INT minimum duration.
    • Each retry can start with ICB peak followed by current limit (ICL) peaks.
  2. Extended Overcurrent Window (t > tRETRY_WINDOW):

    • Limited to 6 retry attempts.
    • First retry cycle happens with minimum tRETRY, EXTD/2 duration.
    • Successive 5 retry cycles happen with minimum tRETRY, EXTD duration.
    • Current peaks are typically limited to ICL.
  3. Latch-off Condition:

    • After 6 unsuccessful retry attempts.

Table 8-3 Response To Thermal Shutdown
LOAD CURRENT CONDITIONS MINIMUM RETRY TIME
ILOAD < ICL - Infinite retry
ILOAD > ICL t < tRETRY_WINDOW tRETRY, INT = 160µs

(typical)

t > tRETRY_WINDOW nRETRY,EXTD < 6 tRETRY, EXTD = 80ms

(typical)

nRETRY,EXTD > 6 Latch-off

In any of the above retry cases the relevant channel restarts when below "restart" conditions are fullfilled.

  1. Temperature Recovery: the TABS or TREL to recover below the THYS level to restart the device.
  2. Retry Window: For ILOAD > ICL, appropriate tRETRY_WINDOW interval must elapse.

In case of ILOAD > ICL, if the retry timer has expired and the temperature of TABS or TREL has not recovered below the THYS level, the channel does not retry until the temperature falls below the THYS level. Once a channel latches off due to an extended overcurrent event, the EN pin can be brought from high to low (with minimum pulse duration of about 20us) to reset the FLT and SNS signal. The output of the channel then follows the EN pin after the initial toggle from high to low.

TPS1HC04-Q1 Retry Protection Mechanism Figure 8-19 Retry Protection Mechanism

The following figures show how the device retries after a hot-short with and without thermal regulation, respectively. When the device experiences a thermal fault and enters the retry cycle, the first current peak in initial retry window reaches ICB threshold, triggering fast trip circuit breaker. Successive current peaks are lower and correspond to set current limit (ICL) value.

TPS1HC04-Q1 Retry Behavior After Hot-Short
                    with Thermal Regulation Figure 8-20 Retry Behavior After Hot-Short with Thermal Regulation
TPS1HC04-Q1 Retry Behavior After Hot-Short
                    with No Thermal Regulation Figure 8-21 Retry Behavior After Hot-Short with No Thermal Regulation

In case the device enters finite retry cycles phase protection mechanism due to overcurrent fault without thermal shutdown fault, the device can stay in thermal regulation in initial retry window and directly enter thermal shutdown retry behavior in extended retry window.