SLVSIN8
June 2026
TPSM65660
ADVMIX
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Descriptions
7.3.1
Input Voltage Range (VIN1, VIN2)
7.3.2
Internal LDO, VCC UVLO, and BIAS Input
7.3.3
Precision Enable and Adjustable Input Voltage UVLO (EN/UVLO)
7.3.4
Output Voltage Setpoint (FB, BIAS)
7.3.5
Adjustable Switching Frequency (RT)
7.3.6
Mode Selection and Clock Synchronization (MODE/SYNC)
7.3.6.1
Clock Synchronization
7.3.6.2
Clock Locking
7.3.7
Device Configuration (CNFG/SYNCOUT)
7.3.8
Dual Random Spread Spectrum (DRSS)
7.3.9
High-Side MOSFET Gate Drive (BST)
7.3.10
Soft Start and Recovery From Dropout
7.3.11
Protection Features
7.3.11.1
Power-Good Monitor
7.3.11.2
Overcurrent and Short-Circuit Protection
7.3.11.3
Hiccup-Mode Protection
7.3.11.4
Thermal Shutdown
7.3.12
Two-Phase, Single-Output Operation
7.4
Device Functional Modes
7.4.1
Shutdown Mode
7.4.2
Active Mode
8
Application and Implementation
8.1
Application Information
8.1.1
Powertrain Components
8.1.1.1
Output Capacitors
8.1.1.2
Input Capacitors
8.1.1.3
EMI Filter
8.1.2
Error Amplifier and Compensation
8.2
Typical Applications
8.2.1
Design 1 – 5V, 6A Synchronous Buck Regulator With Wide Input Voltage Range
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.2.1
Choosing the Switching Frequency
8.2.1.2.2
Input Capacitor Selection
8.2.1.2.3
Output Capacitors
8.2.1.2.4
Output Voltage Setpoint
8.2.1.2.5
Compensation Components
8.2.1.2.6
Setting the Input Voltage UVLO
8.2.1.2.7
EMI Mitigation, RDRSS
8.2.1.2.8
Input Capacitor Selection
8.2.1.3
Application Curves
8.3
Best Design Practices
8.4
Power Supply Recommendations
8.5
Layout
8.5.1
Layout Guidelines
8.5.1.1
Thermal Design and Layout
8.5.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Third-Party Products Disclaimer
9.1.2
Development Support
9.2
Documentation Support
9.2.1
Related Documentation
9.2.1.1
PCB Layout Resources
9.2.1.2
Thermal Design Resources
9.3
Receiving Notification of Documentation Updates
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
11.1
Tape and Reel Information
1
Features
Wide input voltage range: 3.5V to
65V
1% accurate, fixed 3.3V or 5V, or adjustable V
OUT
from 0.8V to 24V
Easy-to-use high power density design
7.2mm × 7.7mm × 3.8mm Enhanced
HotRod™
QFN package with an exposed 3.3μH inductor
Integrated VCC, BST, and high-frequency bypass capacitors reduce design size
Easy design and layout with minimal BOM
Internal compensation, OCP, and TSD
R
θJA
= 18°C/W (
TPSM65660EVM
)
High-efficiency power conversion
> 92% peak efficiency, 24V
IN
to 5V
OUT
, 400kHz
VIN sleep quiescent current as low as 1.8µA
Mitigated interference and noise technology - architecture 2 (MINT 2)
Facilitates
CISPR 11 or 32 Class B
compliance
Enhanced HotRod QFN package with symmetrical pinout, internal bypass capacitors, and low loop inductance
Spread Spectrum (DRSS) and switching
slew-rate control reduce peak emissions
Switching frequency from 300kHz to 2.2MHz
AUTO or FPWM or SYNC operation
Low minimum on time: 36ns (typical)