SLVSJ01 June   2025 TXG8122-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions—TXG8122-Q1
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Electrical Characteristics
    5. 5.5  Supply Current Characteristics
    6. 5.6  Switching Characteristics, VCCA = 3.3 ± 0.3V
    7. 5.7  Switching Characteristics, VCCA = 5 ± 0.5V
    8. 5.8  Electrical Characteristics (85°C)
    9. 5.9  Supply Current Characteristics (85°C)
    10. 5.10 Switching Characteristics, VCCA = 3.3 ± 0.3V (85°C)
    11. 5.11 Switching Characteristics, VCCA = 5 ± 0.5V (85°C)
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Bidirectional Level Translation
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Regulatory Requirements
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC1 to VGND1 Supply voltage to ground voltage, Side 1 –0.5 6.5 V
VCC2 to VGND2 Supply voltage to ground voltage, Side 2 –0.5 6.5 V
VGND1 to VGND2 VGND1 to VGND2 VGND1 to VGND2 -82 82 V
VI SDA1, SCL1  I/O Ports (Side 1) to VGND1 –0.5 VCC1 + 0.5 V
SDA2, SCL2 I/O Ports (Side 2) to VGND2 –0.5 VCC2 + 0.5
VO SDA1, SCL1  I/O Ports (Side 1) to VGND1 –0.5 VCC1 + 0.5 V
SDA2, SCL2 I/O Ports (Side 2) to VGND2 –0.5 VCC2 + 0.5
II SDA1, SCL1 I/O Ports (Side 1) to VGND1 20 mA
SDA2, SCL2 I/O Ports (Side 2) to VGND2 100 mA
IO SDA1, SCL1 I/O Ports (Side 1) to VGND1 20 mA
SDA2, SCL2 I/O Ports (Side 2) to VGND2 100 mA
Tj Junction Temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Section 5.1 may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 5.3 Exposure beyond the limits listed in Section 5.3 may affect device reliability.