SLVSJE4A May   2026  – July 2026 TPS26750A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
      1. 5.1.1 TPS26750A - Absolute Maximum Ratings
      2. 5.1.2 TPS26750A - Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  TPS26750A - Recommended Operating Conditions
    4. 5.4  Recommended Capacitance
    5. 5.5  Thermal Information
    6. 5.6  Power Supply Characteristics
    7. 5.7  Power Consumption
    8. 5.8  POWER_PATH_EN Characteristics - TPS26750A
    9. 5.9  Power Path Supervisory
    10. 5.10 CC Cable Detection Parameters
    11. 5.11 CC PHY Parameters
    12. 5.12 Thermal Shutdown Characteristics
    13. 5.13 ADC Characteristics
    14. 5.14 Input/Output (I/O) Characteristics
    15. 5.15 BC1.2 Characteristics
    16. 5.16 I2C Requirements and Characteristics
    17. 5.17 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  USB-PD Physical Layer
        1. 7.3.1.1 USB-PD Encoding and Signaling
        2. 7.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 7.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 7.3.1.4 USB-PD BMC Transmitter
        5. 7.3.1.5 USB-PD BMC Receiver
        6. 7.3.1.6 Squelch Receiver
      2. 7.3.2  Power Management
        1. 7.3.2.1 Power-On And Supervisory Functions
        2. 7.3.2.2 VBUS LDO
      3. 7.3.3  Power Paths
        1. 7.3.3.1 Internal Sourcing Power Paths
          1. 7.3.3.1.1 PP_5V Current Clamping
          2. 7.3.3.1.2 PP_5V Local Overtemperature Shut Down (OTSD)
          3. 7.3.3.1.3 PP_5V OVP
          4. 7.3.3.1.4 PP_5V UVLO
          5. 7.3.3.1.5 PP_5V Reverse Current Protection
          6. 7.3.3.1.6 PP_CABLE Current Clamp
          7. 7.3.3.1.7 PP_CABLE Local Overtemperature Shut Down (OTSD)
          8. 7.3.3.1.8 PP_CABLE UVLO
      4. 7.3.4  Cable Plug and Orientation Detection
        1. 7.3.4.1 Configured as a Source
        2. 7.3.4.2 Configured as a Sink
        3. 7.3.4.3 Configured as a DRP
        4. 7.3.4.4 Dead Battery Advertisement
      5. 7.3.5  Overvoltage Protection (CC1, CC2)
      6. 7.3.6  Default Behavior Configuration (ADCIN1, ADCIN2)
      7. 7.3.7  ADC
      8. 7.3.8  Liquid Detection
      9. 7.3.9  BC 1.2 (USB_P, USB_N)
      10. 7.3.10 Digital Interfaces
        1. 7.3.10.1 General GPIO
        2. 7.3.10.2 I2C Interface
          1. 7.3.10.2.1 I2C Interface Description
            1. 7.3.10.2.1.1 I2C Clock Stretching
            2. 7.3.10.2.1.2 I2C Address Setting
            3. 7.3.10.2.1.3 Unique Address Interface
            4. 7.3.10.2.1.4 Pin Strapping to Configure Default Behavior
      11. 7.3.11 Digital Core
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power States
      2. 7.4.2 Thermal Shutdown
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Liquid Detection Design Requirements
        2. 8.2.1.2 BC1.2 Application Design Requirements
        3. 8.2.1.3 USB Data Support Design Requirements
        4. 8.2.1.4 EPR Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Liquid Detection
        2. 8.2.2.2 BC1.2 Application
        3. 8.2.2.3 USB Data Support
        4. 8.2.2.4 Power Delivery EPR Support
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Liquid Detection Application Curves
        2. 8.2.3.2 EPR Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 3.3V Power
        1. 8.3.1.1 VIN_3V3 Input Switch
      2. 8.3.2 1.5V Power
      3. 8.3.3 Recommended Supply Load Capacitance
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Recommended Via Size
        2. 8.4.1.2 Minimum Trace Widths
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Schematic
        2. 8.4.2.2 PCB Plots
          1. 8.4.2.2.1 Component Placement
          2. 8.4.2.2.2 PP5V
          3. 8.4.2.2.3 VBUS
          4. 8.4.2.2.4 I/O
          5. 8.4.2.2.5 PPEXT Gate Driver
          6. 8.4.2.2.6 GND
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.3.2 Power Management

The TPS26750A power management block receives power and generates voltages to provide power to the TPS26750A internal circuitry. These generated power rails are LDO_3V3 and LDO_1V5. LDO_3V3 can also be used as a low power output for external EEPROM memory. The power supply path is shown in Figure 7-10.

TPS26750A Power SuppliesFigure 7-10 Power Supplies

The TPS26750A is powered from either VIN_3V3 or VBUS. The normal power supply input is VIN_3V3. When powering from VIN_3V3, current flows from VIN_3V3 to LDO_3V3 to power the core 3.3V circuitry and I/Os. A second LDO steps the voltage down from LDO_3V3 to LDO_1V5 to power the 1.5V core digital circuitry. When VIN_3V3 power is unavailable and power is available on VBUS, the device is considered to be in the dead-battery start-up condition. In a dead-battery start-up condition, the TPS26750A opens the VIN_3V3 switch until the host clears the dead-battery flag through I2C. Therefore, the TPS26750A is powered from the VBUS input with the higher voltage during the dead-battery start-up condition and until the dead-battery flag is cleared. When powering from a VBUS input, the voltage on VBUS is stepped down through an LDO to LDO_3V3.