SLVSJE4A May   2026  – July 2026 TPS26750A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
      1. 5.1.1 TPS26750A - Absolute Maximum Ratings
      2. 5.1.2 TPS26750A - Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  TPS26750A - Recommended Operating Conditions
    4. 5.4  Recommended Capacitance
    5. 5.5  Thermal Information
    6. 5.6  Power Supply Characteristics
    7. 5.7  Power Consumption
    8. 5.8  POWER_PATH_EN Characteristics - TPS26750A
    9. 5.9  Power Path Supervisory
    10. 5.10 CC Cable Detection Parameters
    11. 5.11 CC PHY Parameters
    12. 5.12 Thermal Shutdown Characteristics
    13. 5.13 ADC Characteristics
    14. 5.14 Input/Output (I/O) Characteristics
    15. 5.15 BC1.2 Characteristics
    16. 5.16 I2C Requirements and Characteristics
    17. 5.17 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  USB-PD Physical Layer
        1. 7.3.1.1 USB-PD Encoding and Signaling
        2. 7.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 7.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 7.3.1.4 USB-PD BMC Transmitter
        5. 7.3.1.5 USB-PD BMC Receiver
        6. 7.3.1.6 Squelch Receiver
      2. 7.3.2  Power Management
        1. 7.3.2.1 Power-On And Supervisory Functions
        2. 7.3.2.2 VBUS LDO
      3. 7.3.3  Power Paths
        1. 7.3.3.1 Internal Sourcing Power Paths
          1. 7.3.3.1.1 PP_5V Current Clamping
          2. 7.3.3.1.2 PP_5V Local Overtemperature Shut Down (OTSD)
          3. 7.3.3.1.3 PP_5V OVP
          4. 7.3.3.1.4 PP_5V UVLO
          5. 7.3.3.1.5 PP_5V Reverse Current Protection
          6. 7.3.3.1.6 PP_CABLE Current Clamp
          7. 7.3.3.1.7 PP_CABLE Local Overtemperature Shut Down (OTSD)
          8. 7.3.3.1.8 PP_CABLE UVLO
      4. 7.3.4  Cable Plug and Orientation Detection
        1. 7.3.4.1 Configured as a Source
        2. 7.3.4.2 Configured as a Sink
        3. 7.3.4.3 Configured as a DRP
        4. 7.3.4.4 Dead Battery Advertisement
      5. 7.3.5  Overvoltage Protection (CC1, CC2)
      6. 7.3.6  Default Behavior Configuration (ADCIN1, ADCIN2)
      7. 7.3.7  ADC
      8. 7.3.8  Liquid Detection
      9. 7.3.9  BC 1.2 (USB_P, USB_N)
      10. 7.3.10 Digital Interfaces
        1. 7.3.10.1 General GPIO
        2. 7.3.10.2 I2C Interface
          1. 7.3.10.2.1 I2C Interface Description
            1. 7.3.10.2.1.1 I2C Clock Stretching
            2. 7.3.10.2.1.2 I2C Address Setting
            3. 7.3.10.2.1.3 Unique Address Interface
            4. 7.3.10.2.1.4 Pin Strapping to Configure Default Behavior
      11. 7.3.11 Digital Core
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power States
      2. 7.4.2 Thermal Shutdown
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Liquid Detection Design Requirements
        2. 8.2.1.2 BC1.2 Application Design Requirements
        3. 8.2.1.3 USB Data Support Design Requirements
        4. 8.2.1.4 EPR Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Liquid Detection
        2. 8.2.2.2 BC1.2 Application
        3. 8.2.2.3 USB Data Support
        4. 8.2.2.4 Power Delivery EPR Support
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Liquid Detection Application Curves
        2. 8.2.3.2 EPR Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 3.3V Power
        1. 8.3.1.1 VIN_3V3 Input Switch
      2. 8.3.2 1.5V Power
      3. 8.3.3 Recommended Supply Load Capacitance
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Recommended Via Size
        2. 8.4.1.2 Minimum Trace Widths
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Schematic
        2. 8.4.2.2 PCB Plots
          1. 8.4.2.2.1 Component Placement
          2. 8.4.2.2.2 PP5V
          3. 8.4.2.2.3 VBUS
          4. 8.4.2.2.4 I/O
          5. 8.4.2.2.5 PPEXT Gate Driver
          6. 8.4.2.2.6 GND
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.4.2.2 PCB Plots

The following TPS26750A PCB Layout figures show the recommended layout, placement, and routing.

TPS26750A PCB Layout - Top CompositeFigure 8-12 PCB Layout - Top Composite
TPS26750A PCB Layout - Top Layer 1Figure 8-14 PCB Layout - Top Layer 1
TPS26750A PCB Layout - Signal Layer 3Figure 8-16 PCB Layout - Signal Layer 3
TPS26750A PCB Layout - GND Layer 5Figure 8-18 PCB Layout - GND Layer 5
TPS26750A PCB Layout - Bottom CompositeFigure 8-13 PCB Layout - Bottom Composite
TPS26750A PCB Layout - GND Layer 2Figure 8-15 PCB Layout - GND Layer 2
TPS26750A PCB Layout - Signal Layer 4Figure 8-17 PCB Layout - Signal Layer 4
TPS26750A PCB Layout - Bottom Layer 6Figure 8-19 PCB Layout - Bottom Layer 6