SLVSJL6 June   2026 LM851772-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Buck-Boost Control Scheme
        1. 8.3.1.1 Buck Mode
        2. 8.3.1.2 Boost Mode
        3. 8.3.1.3 Buck-Boost Mode
      2. 8.3.2  Power Save Mode
      3. 8.3.3  Reference System
        1. 8.3.3.1 Power On Reset and nRST-PIN
      4. 8.3.4  Internal VCC Regulators
        1. 8.3.4.1 VCC1 Regulator
        2. 8.3.4.2 VCC2 Regulator
      5. 8.3.5  Enable and Undervoltage Lockout
        1. 8.3.5.1 UVLO
      6. 8.3.6  Error Amplifier and Control
        1. 8.3.6.1 Output Voltage Regulation
        2. 8.3.6.2 Output Voltage Feedback
        3. 8.3.6.3 Voltage Regulation Loop
        4. 8.3.6.4 Dynamic Voltage Scaling
      7. 8.3.7  Output Voltage Discharge
      8. 8.3.8  Peak Current Sensor
      9. 8.3.9  Short Circuit - Hiccup Protection
      10. 8.3.10 Current Monitor/Limiter
        1. 8.3.10.1 Overview
        2. 8.3.10.2 Output Current Limitation
        3. 8.3.10.3 Output Current Monitor
      11. 8.3.11 Oscillator Frequency Selection
      12. 8.3.12 Frequency Synchronization
      13. 8.3.13 Output Voltage Tracking
        1. 8.3.13.1 Analog Voltage Tracking
        2. 8.3.13.2 Digital Voltage Tracking
      14. 8.3.14 Slope Compensation
      15. 8.3.15 Configurable Soft Start
      16. 8.3.16 Drive Pin
      17. 8.3.17 Dual Random Spread Spectrum – DRSS
      18. 8.3.18 Gate Driver
      19. 8.3.19 Cable Drop Compensation (CDC)
      20. 8.3.20 CFG-Pin and R2D Interface
      21. 8.3.21 Advanced Monitoring Features
        1. 8.3.21.1  Overview
        2. 8.3.21.2  BUSY
        3. 8.3.21.3  OFF
        4. 8.3.21.4  VOUT
        5. 8.3.21.5  IOUT
        6. 8.3.21.6  INPUT
        7. 8.3.21.7  TEMPERATURE
        8. 8.3.21.8  CML
        9. 8.3.21.9  OTHER
        10. 8.3.21.10 ILIM_OP
        11. 8.3.21.11 nFLT/nINT Pin Output
        12. 8.3.21.12 Status Byte
      22. 8.3.22 Protection Features
        1. 8.3.22.1 Thermal Shutdown (TSD)
        2. 8.3.22.2 Overcurrent Protection
        3. 8.3.22.3 Output Overvoltage Protection 1 (OVP1)
        4. 8.3.22.4 Output Overvoltage Protection 2 (OVP2)
        5. 8.3.22.5 Input Voltage Protection (IVP)
        6. 8.3.22.6 Power Good
        7. 8.3.22.7 Boot-Strap Undervoltage Protection
        8. 8.3.22.8 Boot-strap Overvoltage Clamp
        9. 8.3.22.9 CRC - CHECK
    4. 8.4 Device Functional Modes
      1. 8.4.1 Overview
      2. 8.4.2 Logic State Description
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Operation
      2. 8.5.2 Clock Stretching
      3. 8.5.3 Data Transfer Formats
      4. 8.5.4 Single READ From a Defined Register Address
      5. 8.5.5 Sequential READ Starting from a Defined Register Address
      6. 8.5.6 Single WRITE to a Defined Register Address
      7. 8.5.7 Sequential WRITE Starting at a Defined Register Address
  10. LM851772-Q1 Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Custom Design with WEBENCH Tools
        2. 10.2.2.2  Frequency
        3. 10.2.2.3  Feedback Divider
        4. 10.2.2.4  Inductor and Current Sense Resistor Selection
        5. 10.2.2.5  Output Capacitor
        6. 10.2.2.6  Input Capacitor
        7. 10.2.2.7  Slope Compensation
        8. 10.2.2.8  UVLO Divider
        9. 10.2.2.9  Soft-Start Capacitor
        10. 10.2.2.10 nRST and EN/UVLO Pull-up Resistor Selection
        11. 10.2.2.11 MOSFETs QH1 and QL1
        12. 10.2.2.12 MOSFETs QH2 and QL2
        13. 10.2.2.13 Loop Compensation
        14. 10.2.2.14 External Component Selection
      3. 10.2.3 Application Curves
    3. 10.3 USB-PD Source with Power Path
    4. 10.4 Parallel (Multiphase) Operation
    5. 10.5 Wireless Charging Supply
    6. 10.6 Power Supply Recommendations
    7. 10.7 Layout
      1. 10.7.1 Layout Guidelines
        1. 10.7.1.1 Power Stage Layout
        2. 10.7.1.2 Gate Driver Layout
        3. 10.7.1.3 Controller Layout
      2. 10.7.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information
    2.     132

Gate Driver Layout

The LM851772-Q1 high-side and low-side gate drivers incorporate short propagation delays, frequency depended dead-time control, and low-impedance output stages capable of delivering large peak currents with very fast rise and fall times to facilitate rapid turn-on and turn-off transitions of the external power MOSFETs. Very high di/dt probably cause unacceptable ringing if the trace lengths are not well controlled. Minimization of stray or parasitic gate loop inductance is key to optimizing gate drive switching performance, whether the inductance is series gate inductance that resonates with MOSFET gate capacitance or common source inductance (common to gate and power loops) that provides a negative feedback component opposing the gate drive command, and thereby increasing MOSFET switching times.

Connections from the gate driver outputs, HO1 and HO2, to the respective gates of the high-side MOSFETs are necessary to be as short as possible to reduce series parasitic inductance. Route HO1 and HO2 and SW1 and SW2 gate traces as a differential pair from the device pin to the high-side MOSFET, taking advantage of flux cancellation by reducing the loop area.

Connections from gate driver outputs, LO1 and LO2, to the respective gates of the low-side MOSFETs are necessary to be as short as possible to reduce series parasitic inductance. Route LO1 and LO2, and PGND traces as a differential pair from the device pin to the low-side MOSFET, taking advantage of flux cancellation by reducing the loop area.

Minimize the current loop path from the VCC, HB1, and HB2 pins through the respective capacitors as these provide the high instantaneous current.