SLVSJQ4 May   2026 TMF0020

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Functional Tests
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 20480-Bit FRAM
      2. 6.3.2 FRAM Status Memory
      3. 6.3.3 Address Registers and Transfer Status
      4. 6.3.4 Writing Data to the FRAM
      5. 6.3.5 TMF0020 Device ID
      6. 6.3.6 Bus Termination
    4. 6.4 Device Functional Modes
      1. 6.4.1 Test Procedures for Functional Tests
        1. 6.4.1.1 Multiple Target Configurations
    5. 6.5 Programming
      1. 6.5.1 Serial Communication
      2. 6.5.2 Initialization
      3. 6.5.3 ROM Commands
        1. 6.5.3.1 READ ROM Command [33h]
        2. 6.5.3.2 MATCH ROM Command [55h]
        3. 6.5.3.3 SKIP ROM Command [CCh]
        4. 6.5.3.4 SEARCH ROM Command [F0h]
        5. 6.5.3.5 RESUME Command [A5h]
        6. 6.5.3.6 OVERDRIVE SKIP ROM Command [3Ch]
        7. 6.5.3.7 OVERDRIVE MATCH ROM Command [69h]
      4. 6.5.4 Memory Function Commands
        1. 6.5.4.1 Write Scratchpad Command [0Fh]
        2. 6.5.4.2 Read Scratchpad Command [AAh]
        3. 6.5.4.3 Copy Scratchpad [55h]
        4. 6.5.4.4 Read Memory [F0h]
        5. 6.5.4.5 Extended Read Memory [A5h]
        6. 6.5.4.6 Memory Command Flow Charts
      5. 6.5.5 SDQ single-wire serial interface Signaling
        1. 6.5.5.1 RESET and PRESENCE PULSE
        2. 6.5.5.2 Write-Read-Time Slots
      6. 6.5.6 IDLE
      7. 6.5.7 CRC Generation
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information
    2. 10.2 Tape and Reel Information

Timing Requirements

Minimum and Maximum specifications apply from TA of −10°C to 85°C. Typical specifications are at 25°C and VPUP = 3.3V and 5V (unless otherwise noted).
MINNOMMAXUNIT
I/O PIN: GENERAL DATA
tSTARTUPStart-up timeMinimum time SDQ single-wire serial interface must be HIGH before device responds with a presence pulse10ms
tRECRecovery TimeStandard speed(1)(2)5µs
Overdrive speed(1)(2)5µs
tREHRising-Edge Hold-Off TimeStandard speed(1)(2)0.55µs
tSLOTTime Slot DurationStandard speed(3)65µs
Overdrive speed(3)11µs
I/O PIN: SINGLE-WIRE RESET, PRESENCE-DETECT CYCLE
tRSTLReset Low TimeStandard speed480550µs
Overdrive speed4880µs
tPDHPresence-Detect High PulseStandard speed1560µs
Overdrive speed26µs
tPDLPresence-Detect Low TimeStandard speed60240µs
Overdrive speed824µs
tPDSPresence-Detect Sample Time (4),(5)Standard speed607075µs
Overdrive speed68.710µs
IO PIN: SINGLE-WIRE WRITE
tW0LWrite-Zero Low TimeStandard speed(6)60120µs
Overdrive speed(6)

6

15.5µs
tW1LWrite-One Low TimeStandard speed(6)115µs
Overdrive speed(6)12µs
IO PIN: SINGLE-WIRE READ
tRLRead Low TimeStandard speed(2)(7)515 - tRCµs
Overdrive speed(2)(7)12 - tRCµs
tRDSRead Sample Time (8)Standard speed(2)(7)tRL + tRC15µs
Overdrive speed(2)(7)tRL + tRC3µs
FRAM
NCYWrite/Erase Cycles (Endurance)(2)1MCycles
tPROGProgramming Time(2)For all 20Kb of memory1ms
tDRData Retention(9)At 80°C10Years

At 85°C

7

Make sure the voltage on SDQ single-wire serial interface is less or equal to VILMAX at all times when the host is driving SDQ single-wire serial interface to a logic 0 level.
Specified by design, characterization or simulation only. Not production tested.
Defines maximum possible bit rate.
Interval after tRSTL during which a bus host can read logic 0 on SDQ single-wire serial interface if a TMF0020 is present. The presence detect pulse can be outside this interval, but is complete within 2ms after power-up. This behavior addresses the scenario where the one-wire device has been powered off (bus low) for a long time. Bus power is then applied. The device is allowed to malfunction, and generate a presence pulse that violates the presence timing specification. However, the abnormal condition is resolved typically within 10ms.
System requirement.
tε in Figure 6-18 and Figure 6-19 represents the time required for the pullup circuitry to raise the voltage on the SDQ single-wire serial interface pin from VIL to VTH. Hence the actual maximum duration for the host to pull the line low is tW1LMAX + tF – tε and tW0LMAX + tF – tε, respectively.
tRC in Figure 6-20 represents the time required for the pullup circuitry to raise the voltage on the SDQ single-wire serial interface pin from VIL to the input-high threshold of the host device. Hence, the actual maximum duration for the host to pull the line low is tRLMAX + tF.
Refers to the minimum time after which the recognition of negative edge is possible after VTH has been reached on the preceding rising edge.
Data retention time is degraded as TA increases. Long-term storage at elevated temperatures is not recommended.